References
R.J. Kerans, R.S. Hay, N.J. Pagano, and T.A. Parthasarathy, Ceram. Bull. 68 (2) (1989) p. 429.
G.C. Papanicolaou, S.A. Paipetis, and P.S. Theocaris, J. Colloid Polymer Sci. 256 (7) (1978) p. 625; K.M. Prewo, in Proc. Fourth Japan-U.S. Conference on Composite Materials (Technomic, Lancaster, PA, 1989) p. 24–40.
R.S. Raghava, J. Reinf. Plastics Comp. 9 (1990) p. 151.
M.R. Piggott, Carbon 27 (5) (1989) p. 657; W.K. Tredway, K.M. Prewo, and C.G. Pantano, Carbon 27 (5) (1989) p. 717; A.S. Argon, V. Gupta, H.S. Landis, and J.A. Cornie, Mat. Sci. Eng. A107 (1989) p. 41; M.K. Brun and R.N. Singh, Adv. Ceram. Mater. 3 (5) (1988) p. 506; T. Pradell, C. Olagnon, and E. Bullock, J. Mater. Sci. Lett. 9 (1990) p. 960; G.P. Tandon and N.J. Pagano, in Proc. Fourth Japan-U.S. Conference on Composite Materials, (Technomic, Lancaster, PA, 1989) p. 191; S.G. Fishman and A.M. Diness, ibid., p. 209–215.
Y. Maniette and A. Oberlin, J. Mater. Sci. 25 (1990) p. 3864; S.D. Peteves, P. Tambuyser, P. Helbach, M. Audier, V. Laurent, and D. Chatain, J. Mater. Sci. 25 (8) (1990) p. 3765; K. Nishiyama, S. Umekawa, M. Yuasa, and I. Fukumoto, in Proc. Fourth Japan-U.S. Conference on Composite Materials (Technomic, Lancaster, PA, 1989) p. 776–788; C. Jones, C.J. Kiely, and S.S. Wang, J. Mater. Res. 4 (2) (1989) p. 327; 5 (7) (1990) p. 1435; S.J. Baker and W. Bonfield, J. Mater. Sci. 13 (1978) p. 1329.
R.N. Singh, J. Am. Ceram. Soc. 72(9) (1989) p. 1764; R.N. Singh and M.K. Brun, Adv. Ceram. Mater. 3 (3) (1988) p. 235; R.P. Boisvert, R.K. Hutter, and R.J. Diefendorf, in Proc. Fourth Japan-U.S. Conference on Composite Materials (Technomic, Lancaster, PA, 1989) p. 789–798.
S. Abraham, B.C. Pai, K.G. Satyanarayana, and V.K. Vaidyan, in Interfacial Phenomena in Composite Materials’ 89 edited by F.R. Jones (Butterworths, Boston, MA, 1989) p. 276–281.
L. Aggour, E. Fitzer, E. Ignotowitz, M. Sahebkar, Carbon 12 (1974) p. 358; Vapor Deposition, edited by C.F. Powell, J.H. Oxley, and J.M. Blocher (Wiley and Sons, New York, 1966).
H.H. Streckert, F.C. Montgomery, T.D. Tilley, B.K. Campion, and R.H. Heyn, in Ultrastructure Processing of Advanced Ceramics, edited by J.D. Mackenzie and D.R. Ulrich (Wiley & Sons, New York, 1988) p. 963–972.
H. Fukunaga and K. Goda, in Proc. Fourth Japan-U.S. Conference on Composite Materials (Technomic, Lancaster, PA, 1989) p. 653–660; L. Hwan, S. Suib, J. Am. Ceram. Soc. 72 (7) (1989) p. 1259.
B. Rand, in Interfacial Phenomena in Composite Materials’ 89, edited by F.R. Jones (Butterworths, Boston, MA, 1989) p. 15–24. Also see references 1–8.
J.R. Strife, J.E. Sheehan, Ceram. Bull. 67 (2) (1988) p. 369; Y. Deslandes and F.N. Sabir, J. Mater. Sci. Lett. 9(2) (1990) p. 200.
S.M. Sim, P-Y. Chu, R.H. Krabill, and D.E. Clark, in Ultrastructure Processing of Advanced Ceramics, edited by J.D. Mackenzie and D.R. Ulrich (Wiley & Sons, New York, 1988) p. 995–1010.
M. Peuckert, T. Vaahs, and M. Bruck, Adv. Mater. 2 (9) (1990) p. 398.
M. Okamoto, H. Yokoyama, and Y. Osaka, Jpn. J. Appl. Phys. 29 (5) (1990) p. 930; H. Vincent, M. Boubehira, J. Bouix, C. Bernard, and A. Roche, J. Crystal Growth 75 (1986) p. 504.
W. Weisweiler, E. Fitzer, G. Nagel, and H. Jager, Thin Solid Films 148 (1987) p. 93.
D.C. Cranmer, Ceram. Bull. 68 (2) (1989) p. 415.
L.V. Interrante, G.A. Sigel, M. Garbauskas, C. Hejna, and G.A. Slack, Inorg. Chem. 28 (2), (1989) p. 252; L.V. Interrante, W. Lee, M. McConnell, N. Lewis, and G.A. Slack, J. Electrochem. Soc. 136 (1989) p. 472.
L. Mond, C. Langer, and F. Quinke, J. Chem. Soc. London 57 (1890) p. 749; H.E. Carlton, and W.M. Goldberger, J. Met. 17 (1965) p. 611; R. Kaplan and N. Bottka, Appl. Phys. Lett. 41 (1982) p. 972; R. Kaplan, J. Vac. Sci. Technol. A 1 (1983) p. 551; J.S. Foord and R.B. Jackman, Chem. Phys. Lett. 112 (1984) p. 190.
S. Varma, Y.G. Kim, Z. Psenicnik, P.A. Dowben, and R.R. Birge, in Protective Coatings: Processing and Characterization, edited by R.M. Yazici (TMS, Warrendale, PA, 1989) p. 101–110.
P.A. Dowben, J.T. Spencer, and G.T. Stauf, Mater. Sci. Eng. B2 (1989) p. 297; Tungsten and Other Refractory Metals for VLSI Applications, Vol. III, edited by V.A. Wells (Mater. Res. Soc., Pittsburgh, PA, 1988), and Vol. IV, edited by R.S. Blewer and C.M. McConica (1989).
M.J. Cooke, R.A. Heinecke, R.C. Stern, and J.W. Maes, Solid State Technol. 25 (12) (1982) p. 62; R.A. Levy and M.L. Green, J. Electrochem. Soc. 134 (1987) p. 37C.
F.A. Houle, C.R. Jones, T.H. Baum, C. Pico, and C.A. Kovac, Appl. Phys. Lett. 46 (1985) p. 204; C. Oehrand and H. Suhr, Appl. Phys. A 45 (1988) p. 151.
D.B. Beach, F.K. LeGoues, and C.K. Hu, Chem. Mater. 2 (1990) p. 216.
P.M. Jeffries and G.S. Girolami, Chem. Mater. 1 (1989) p. 8.
S.C. Geol, K.S. Kramer, M.Y. Chiang, and W. Buhro, Polyhedron 9 (1990) p. 611.
H.K. Shin, K.M. Chi, M.J. Hampden-Smith, T.T. Kodas, J.D. Farr, and M.F. Paffett, “Synthesis of New Copper(I) B-Diketonate Compounds For CVD of Copper” in Chemical Perspectives of Microelectronic Materials — II, edited by L.H. Dubois, L.V. Interrante, M.E. Gross, and K.F. Jensen (Mater. Res. Soc. Symp. Proc, 204, Pittsburgh, PA, 1991) p. 421.
L.V. Koplitz, C.K. Shuh, Y.J. Chen, R.S. Williams, and J.I. Zink, Appl. Phys. Lett. 53 (18) (1988) p. 1705.
R. Kumar, S. Roy, M. Rashidi, and R.J. Puddephat, Polyhedron 8 (1989) p. 551; S. Roy, R.J. Puddephat, and J.D. Scott, J. Chem. Soc. Dalton Trans. (1989) p. 2121.
R.J. Puddephat and I. Treuernicht, J. Organomet. Chem. 319 (1987) p. 129.
M. Nemoto and M. Yamanaka, J. Mater. Res. 5 (1990) p. 1; K. Wanatabe, H. Yamane, H. Kurasawa, T. Hirai, N. Kobayashi, H. Iwasake, K. Noto, and Y. Muto, Appl. Phys. Lett. 54 (1989) p. 575; A.P. Purdy, A.D. Berry, R.T. Holm, M. Fatemi, and D.K. Gaskill, Inorg. Chem. 28 (1989); A.D. Berry, R.T. Holm, M. Fatemi, D.K. Gaskill, R. Kaplan, and W.B. Fox, J. Cryst. Growth. 92 (1988) p. 344; J. Zhao, K.H. Dahmen, H.O. Marcy, L.M. Tonge, T.J. Marks, B.W. Wessels, and C.R. Kannewurf, Phys. Lett. 53 (1988) p. 1548.
D.C. Bradley, Chem. Rev. 89 (1989) p. 1317; C.C. Bradley, Philos. Trans. R. Soc. Lond., Ser. A 330 (1990) p. 167.
J. Saraie, J. Kwon, and Y. Yodogawa, J. Electrochem. Soc. 132(4) (1985) p. 890.
R.E. Seivers, K.J. Eisentraut, C.S. Springer Jr., and D.W. Meek, in Lanthanide/Actinide Chemistry, Advances in Chemistry Series, Vol. 71 (American Chemical Society, 1967) p. 141–154; E.W. Berg and J.J. Chiang-Acosta, Ann. Chim. Acta. 40 (1968) p. 101; A.P. Purdy, A.D. Berry, R.T. Holm, M. Fatemi, and D.K. Gaskill, Inorg. Chem. 28 (1989) p. 2799.
K. Kamata, S. Matsumato, and Y. Shibata, Yogya Kyokaishi 90 (1) (1982) p. 46; A.D. Berry, D.K. Gaskill, R.T. Holm, E.J. Cukauskas, R. Kaplan, and R.L. Henry, Appl. Phys. Lett. 52 (20) (1988) p. 1743; V.A. Varyukhin, V.Y. Vodzinskiy, V.A. Domrachev, B.I. Kozyrkin, V.V. Kutyreva, and O.N. Suvorova, in Probl. Khim. Primen. Beta-Diketonatov Met., 1st edition, edited by V. Spitsyn (1982) p. 178–84.
S. Matsuno, F. Uchikawa, K. Yoshizaki, Jpn. J. Appl. Phys., Part 2 29 (6), (1990) L947; A.R. Barron, J.M. Buriak, L. Cheatham, and R. Gordon, in Electrochemical Society 177th Meeting, Abstract 943 HTS, Montreal, Quebec, Canada; T.H. Geballe, A. Sanjurjo, D. Hildenbrand, G. Craig, M. Zisk, J. Collman, S.A. Banning, and R.E. Sievers, J. Appl. Phys. 66 (1989) p. 444.
D.C. Bradley and M.M. Faktor, Trans. Faraday Soc. 55 (1959) p. 2117.
A. Politychi and K. Hierber, in Sci. Technol. Surf. Coat., NATO Adv. Study Inst., edited by B.N. Chapman and J.C. Anderson (Academic Publishing, London, 1972) p. 159–168.
C.C. Wang, K.H. Zaninger, and M.T. Duffy, RCA Rev. 31 (1970) p. 728.
B. Delperier, F. Maury, R. Calsou, R. Morancho, Proc. 10th International Conf. on CVD (Proc. Electrochemical Society, 87–88, 1987) p. 1139–46.
D.J. Larkin, L.V. Interrante, and A. Bose, J. Mater. Sci. 5 (11) (1990) p. 2706.
R.T. Paine and C.K. Narula, Chem. Rev. 90 (1) (1990) p. 73.
M.G.L. Mirabelli, A. Lynch, L.G. Sneddon, Solid State Ionics 32/33 (1989) p. 655.
M.H. Rand and J.F. Roberts, J. Electrochem. Soc. 115 (4) (1968) p. 423, and references therein.
R.S. Pease, Acta Crystallogr. 5 (1952) p. 356.
J.S. Beck, C.R. Albani, A.R. McGhie, J.B. Rothman, and L.G. Sneddon, Chem. Mater. 1 (4) (1990) p. 433.
A.T. Lynch and L.G. Sneddon, J. Am. Chem. Soc. 111 (16) (1989) p. 6201.
P.J. Fazen, J.S. Beck, A.T. Lynch, E.E. Remsen, and L.G. Sneddon, Chem. Mater. 2 (2) (1990) p. 96.
C.K. Narula, R. Schaeffer, A.K. Datye, T.T. Borek, B.M. Rapko, and R.T. Paine, Chem Mater. 2 (4) (1990) p. 384; R.T. Paine, C.K. Narula, R. Schaeffer, and A.K. Datye, ibid. 1 (5) (1989) p. 486.
C.K. Narula, D.A. Lindquist, M. Fan, T.T. Borek, E.N. Duesler, A.K. Datye, R. Schaeffer, and R.T. Paine, Chem Mater. 2 (4) (1990) p. 377.
V.Y. Doo, D.R. Kerr, and D.R. Nichols, J. Electrochem. Soc. 115 (1) (1968) p. 61.
C.L. Beatty, in Ultrastructure Processing of Ceramics, Glasses, and Composites, edited by L.L. Hench and D.R. Ulrich (Wiley & Sons, New York, 1984) p. 272–91; D. Seyferth and G.H. Wiseman, ibid., p. 265–71.
R.M. Fix, R.G. Gordon, D.M. Hoffman, Chem. Mater. 2 (3) (1990) p. 235.
Y.D. Blum, R.M. Platz, E.J. Crawford, J. Am. Ceram. Soc. 73 (1) (1990) p. 170; S.J. Lenhart, Y.D. Blum, R.M. Laine, Corrosion 45 (6) (1989) p. 503.
K. Sugiyama, S. Pac, Y. Takahashi, S. Motojima, J. Electrochem. Soc. 22 (11) (1975) p. 1545.
R.G. Gordon, D.M. Hoffman, and U. Riaz, Chem. Mater. 2 (5) (1990) p. 480; R.G. Gordon, D.M. Hoffman, and U. Riaz, “Atmospheric Pressure Chemical Vapor Deposition of Main-Group Nitride Thin Films,” in Chemical Perspectives of Microelectronic Materials — II, edited by L.H. Dubois, L.V. Interrante, M.E. Gross, and K.F. Jensen (Mater. Res. Soc. Symp. Proc. 204, 1991), p. 95.
R.M. Fix, R.G. Gordon, D.M. Hoffman, J. Am. Chem. Soc. 112 (21) (1990) p. 7833; also see reference 56b.
D.C. Boyd, R.T. Haasch, D.R. Mantell, R.K. Schulze, J.F. Evans, and W.L. Gladfelter, Chem Mater. 1 (1) (1989) p. 119.
J.W. Hwang, S.A. Hanson, D. Britton, J.F. Evans, K.F. Jensen, and W.L. Gladfelter, Chem. Mater. 2 (3) (1990) p. 342.
Z. Jiang and L.V. Interrante, Chem Mater. 2 (4) (1990) p. 439.
M.M. Seibold and C. Russel, J. Am. Ceram. Soc. 72 (8) (1989) p. 1503; I. Teusel and C. Russel, J. Mater. Sci. 25 (8) (1990) p. 3531.
H.E. O’Neal and M.A. Ring, J. Organomet. Chem. 213 (1981) p. 419.
D.J. Larkin, L.V. Interrante, J.B. Hudson, and B. Han, in Mater. Res. Soc. Symp. Proc. 204 (1991) p. 141.
W. Lee, L.V. Interrante, C. Czekaj, J. Hudson, K. Lenz, and B. Sun, in Mat. Res. Soc. Symp. Proc. 131 (1989) p. 431; H.E. Fischer, L.V. Interrante, unpublished work.
S. Yajima, K. Okamura, J. Hayashi, and M. Omori, J. Am. Ceram. Soc. 59 (1976) p. 324; Chem. Lett. (1975) p. 1209.
C.L. Schilling Jr., Br. Polym. J. 18 (6) (1985) p. 355; C.L. Schilling Jr., J.P. Wesson, T.C. Williams, J. Polym. Sci. Polym. 70 (1983) p. 121; R.H. Baney, J.H. Gaul Jr., and T.K. Hilty, Organometal. 2 (1982) p. 859; L.M. Niebyiski, U.S. Patent 4,873,353 (1989); Katzman, U.S. Patent 4,737,382 (1988); R.H. Baney, Brit. U.K. Patent Appl., GB 2021545 (Dec. 5, 1979).
G.S. Girolami, J.A. Jensen, D.M. Pollina, W.S. Williams, A.E. Kaloyeros, and C.M. Allocca, J. Am. Chem. Soc. 109 (1987) p. 1579; C.M. Alloca, W.S. Williams, A.E. Kaloyeros, J. Electrochem. Soc. 134 (12) (1987) p. 3170.
J.A. Jensen, J.E. Gozum, D.M. Pollina, and G.S. Girolami, J. Am. Chem. Soc. 110 (5) (1988) p. 1643.
H. Du, B. Gallois, and K.E. Gonsalves, Chem. Mater. 1 (6) (1989) p. 569.
R. Morancho, G. Constant, and J.J. Ehrhardt, Thin Solid Films 77 (1981) p. 155.
R. Yazici, K. Gonsalves, and S. Han, in Protective Coatings: Processing and Characterization, edited by R.M. Yazici (TMS, Warrendale, PA, 1989) p. 91–100.
Rights and permissions
About this article
Cite this article
Fischer, H.E., Larkin, D.J. & Interrante, L.V. Fiber Coatings Derived from Molecular Precursors. MRS Bulletin 16, 59–65 (1991). https://doi.org/10.1557/S0883769400057122
Published:
Issue Date:
DOI: https://doi.org/10.1557/S0883769400057122