Summary
Throughout most of the 1980s, much of the electronic packaging community focused on design issues rather than manufacturing issues of electronic packaging. Recently, through the cooperative efforts of electronic and physical designers, materials scientists, and process and manufacturing engineers, a new electronic packaging technology with associated manufacturing materials and processes has been developed that significantly improves parameters of importance to all team members. Critical to conceptualizing and implementing this new approach was a fundamental paradigm shift in eliminating the need to inspect quality into soldered interconnections. This paradigm shift was made possible by introducing an absolute quality goal, Six Sigma. Through attention to detail in material selection and process control, Motorola has developed a high-volume, low-cost Six Sigma process for reflow soldering which eliminated the need to inspect the soldered interconnections.
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Pfahl, R.C. Materials in Electronic Manufacturing: Electronic Packaging. MRS Bulletin 17, 38–41 (1992). https://doi.org/10.1557/S0883769400041051
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DOI: https://doi.org/10.1557/S0883769400041051