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Test Structures as a Way to Evaluate Packaging Reliability

  • Materials Reliability in Microelectronics
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References

  1. J.N. Sweet, M.R. Tuck, D.W. Peterson, and D.W. Palmer, Trans. CHMT 14 (3) (1991) p. 529.

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  2. G.G. Harman, Wire Bonding in Microelectronics (ISHM, 1989) p. 141.

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  3. D.A. Doane and P.D. Franzon, Multichip Module Technologies and Alternatives, The Basics (Van Nostrand Reinhold, New York, 1993).

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  4. For more information on AAPT contact Joseph A. Carpenter, NIST, telephone (301) 9756119; for RelTech working group contact John Evans, NASA, telephone (202) 358-0535.

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Authors
  1. David W. Palmer
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Palmer, D.W. Test Structures as a Way to Evaluate Packaging Reliability. MRS Bulletin 18, 55–58 (1993). https://doi.org/10.1557/S0883769400039105

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  • DOI: https://doi.org/10.1557/S0883769400039105

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