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Stress-Induced Void Formation in Metal Lines

  • Materials Reliability in Microelectronics
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Authors
  1. Paul A. Flinn
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  2. Anne Sauter Mack
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  3. Paul R. Besser
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  4. Thomas N. Marieb
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Flinn, P.A., Mack, A.S., Besser, P.R. et al. Stress-Induced Void Formation in Metal Lines. MRS Bulletin 18, 26–35 (1993). https://doi.org/10.1557/S0883769400039051

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