References
J. Proud, R.A. Gottscho, J.A. Bondur, A. Garscadden, J.V. Heberlein, G.K. Herb, M.J. Kushner, J.E. Lawler, M.A. Lieberman, T.M. Mayer, A.V. Phelps, W. Roman, H.H. Sawin, and H.F. Winters, Plasma Processing of Materials: Scientific Opportunities and Technological Challenges (National Academy Press, Washington, DC, 1991).
M.A. Lieberman, G. Selwyn, and M. Tuszewski, MRS Bulletin 20 (3) (1996).
M.A. Lieberman and A.J. Lichtenberg, Principles of Plasma Discharges and Materials Processing (John Wiley & Sons, Inc., New York, 1994).
J.F. Morar, F.R. McFeely, N.D. Shinn, G. Landgren, and F.J. Himpsel, Appl. Phys. Lett. 45 (1984) p. 174.
J.W. Coburn and H.F. Winters, J. Appl. Phys. 50 (1979) p. 3189.
O. Joubert, G.S. Oehrlein, and M. Surendra, J. Vac. Sci. Technol. A 12 (1994) p. 665.
A.D. Bailey III, M.C.M. van de Sanden, J.A. Gregus, and R.A. Gottscho, J. Vac. Sci. Technol. B13 (1994) p. 92.
W.E. Howard, IBM J. Res. Dev. 36 (1992) p. 3.
S.W. Depp and W.E. Howard, Sci. Am. 268 (1993) p. 90.
E. Korczynski, Solid State Technol. 39 (1996) p. 63.
Y. Hishikawa, S. Tsuda, K. Wakisaka, and Y. Kuwano, J. Appl. Phys. 73 (1993) p. 4227.
J.T. Verdeyen, J. Beberman, and L. Overzet, J. Vac. Sci. Technol. A 8 (1990) p. 1851.
A.A. Howling, J.L. Dorier, and C. Hollenstein, Appl. Phys. Lett. 62 (1993) p. 1341.
S. Ashida, C. Lee, M.R. Shim, and M.A. Lieberman, Proc. Dry Process Symp. (The Electrochemical Society of Japan, Tokyo, 1995) p. 21.
C.T. Gabriel and J.P. McVittie, Solid State Technol. (June 1992) p. 81.
S. Samukawa, Jpn. J. Appl. Phys. 29 (1990) p. 980.
J.C. Arnold and H.H. Sawin, J. Appl. Phys. 70 (1991) p. 5314.
K. Hashimoto, Y. Hikosaka, A. Hasegawa, and M. Nakamura, Proc. Dry Process Symp. (The Electrochemical Society of Japan, 1995) p. 17.
R.A. Gottscho, C.W. Jurgensen, and D.J. Vitkavage, J. Vac. Sci. Technol. B10 (1992) p. 2133.
R.A. Gottscho, J. Vac. Sci. Technol. B11 (1993) p. 1884.
A.D. Bailey III and R.A. Gottscho, Jpn. J. Appl. Phys. 34 (1995) p. 2083.
Rights and permissions
About this article
Cite this article
Gottscho, R.A., Barone, M.E. & Cook, J.M. Use of Plasma Processing in Making Integrated Circuits and Flat-Panel Displays. MRS Bulletin 21, 38–42 (1996). https://doi.org/10.1557/S0883769400035697
Published:
Issue Date:
DOI: https://doi.org/10.1557/S0883769400035697