Skip to main content
SpringerLink
Log in

Integration of Low-k Dielectric Materials Into Sub-0.25-μm Interconnects

  • Low-Dielectricconstant Materials
  • Published:
MRS Bulletin Aims and scope Submit manuscript

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

References

  1. M. Bohr, in Adanced Metallization and Interconnect Systems for ULSI Applications in 1996, edited by R. Havemann, J. Schmitz, H. Komiyama, and K. Tsubouchi (Materials Research Society, Pittsburgh, 1997) p. 3.

  2. K. Yamashita and S. Odanaka, VLSI Technol Symp. Tech. Dig. (1997) p. 53.

    Google Scholar 

  3. P. Dixit, in Proc. SEMATECH Workshop on Low Dielectric Constant Materials and Interconnects (SEMATECH, San Diego, 1996) p. 1.

    Google Scholar 

  4. S-P. Jeng, R. Havemann, and M. Chang, in Advanced Metallization for Devices and Cicuits — Science, Technology, and Manufacturability, edited by S.P. Murarka, A. Katz, K.N. Tu, and K. Maex (Mater. Res. Soc. Symp. Proc. 337, Pittsburgh, 1994) p. 25.

  5. C. Jin, L. Ting, K. Taylor, T. Seha, and J.D. Luttmer, in Proc. Dielectrics for ULSI Multilevel Interconnection Conf. (Santa Clara, CA, 1996) p. 21.

    Google Scholar 

  6. W-Y. Shih, J. Levine, and M. Chang, in Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, edited by R. Havemann, J. Schmitz, H. Komiyama, and K. Tsubouchi (Materials Research Society, 1997) p. 479.

  7. D.T. Price, R.J. Gutmann, and S.P. Murarka, in Proc. SEMATECH Workshop on Low Dielectric Constant Materials and Interconnects (SEMATECH, San Diego, 1996) p. 479.

    Google Scholar 

  8. J. Waeterloos, H. Meynen, B. Coenegrachts, J. Grillaert, and L. Van den hove, Ibid. p. 404.

  9. S-P. Jeng, M-C. Chang, T. Kroger, P. Me Anally, and R.H. Havemann, VLSI Technol. Symp. Tech. Dig. (1994) p. 73.

    Google Scholar 

  10. A.K. Stamper, V. McGahay, and J.P. Hummel, in Proc. Dielectrics for ULSI Multilevel Interconnection Conf. (Santa Clara, CA, 1997) p. 13.

    Google Scholar 

  11. S. Bothra, L.Q. Qian, M. Weling, and D. Pramanik, Ibid. p. 273.

    Google Scholar 

  12. D. Tobben, D. Groteloh, and O. Spindler, Ibid. (1996) p. 29.

    Google Scholar 

  13. M.Z. Karim and D.R. Evans, Ibid. p. 63.

    Google Scholar 

  14. H. Kudo, S. Takeishi, R. Shinohara, and M. Yamada, Ibid. (1997) p. 85.

    Google Scholar 

  15. J.G. Fleming and E. Roherty-Osmun, Ibid. p. 139.

    Google Scholar 

  16. J.G. Fleming, E. Roherty-Osmun, and A.J. Farino, in Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, edited by R. Havemann, J. Schmitz, H. Komiyama, and K. Tsubouchi (Materials Research Society, Pittsburgh, 1997) p. 471.

  17. A. Singh, G. Dixit, R.S. List, S.W. Russell, A.R.K. Ralston, D. Aldrich, W-Y. Shih, S. Nag, A.J. McKerrow, C. Jin, W. Lee, J.D. Luttmer, and R.H. Havemann, in Proc. Low and High Dielectric Constant Materials, (Electrochemical Society, Montreal, 1997).

    Google Scholar 

  18. A. Nakashima, M. Egami, M. Komatsu, Y. Ohkura, M. Miyajima, H. Harada, and S. Fukuyama, in Proc. Dielectrics for ULSI Multilevel Interconnection Conf. (Santa Clara, CA, 1997) p. 303.

    Google Scholar 

  19. M.K. Jain, S. Nag, G.A. Dixit, J.D. Luttmer, and R.H. Havemann, in Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, edited by R. Havemann, J. Schmitz, H. Komiyama, and K. Tsubouchi (Materials Research Society, Pittsburgh, 1997) p. 423.

  20. C.B. Case, C.J. Case, A. Kornblit, M.E. Mills, D. Castillo, and R. Liu, Ibid. (1996) p. 449.

  21. R.S. List, C. Jin, S.W. Russell, S. Yamanaka, L. Olsen, L. Le, L.M. Tang, and R.H. Havemann, VLSI Technol. Symp. Tech. Dig. (1977) p. 77.

    Google Scholar 

  22. C. Jin, R.S. List, W.W. Lee, C. Lee, J.D. Luttmer, and R.H. Havemann, in Low-Dielectric Constant Materials II, edited by K. Uram, H. Treichel, A.C. Jones, and A. Lagendijk (Mater. Res. Symp. Proc. 443, Pittsburgh, 1997).

  23. -, in Advanced Metallization for ULSI Applications in 1996, edited by R. Havemann, J. Schmitz, H. Komiyama, and K. Tsubouchi (Materials Research Society, 1997) p. 463.

  24. N. Oda, T. Usami, K. Kishimoto, A. Matsumoto, K. Mikagi, K. Kikuta, H. Gomi, and I. Sakai, VLSI Technol. Symp. Tech. Dig. (1997) p. 79.

    Google Scholar 

  25. A.R.K. Ralston, J.F. Gaynor, A. Singh, L.V. Le, R.H. Havemann, M.A. Piano, T. Cleary, J.C. Wing, and J. Kelly, Ibid. (1997) p. 81.

    Google Scholar 

  26. Y. Matsubara, K. Endo, T. Tatsumi, H. Ueno, K. Sugai, and T. Horiuchi, Proc. IEEE IEDM (1996) p. 369.

    Google Scholar 

  27. G.A. Biery and C-K. Hu, Proc. SEMATECH Workshop on Low Dielectric Constant Materials and Interconnects (SEMATECH, San Diego, 1996) p. 499.

    Google Scholar 

  28. K. Yoshiyama, K. Okada, M. Igarahi, K. Yamada, S. Shimizu, Y. Takata, A. Osaki, K. Higashitani, and S. Asai, VLSI Technol. Symp. Tech. Dig. (1997) p. 55.

    Google Scholar 

  29. T.C. Holloway, G.A. Dixit, D.T. Grider, S.P. Ashburn, R. Aggarwal, A. Shih, X. Zhang, G. Musium, A.L. Esquivel, M. Jain, S. Madan, T. Breedijk, A. Singh, G. Thakar, G. Shinn, B. Riemenschneider, S. O’Brien, D. Frystak, J. Kittl, A. Amerasekera, S. Aur, A. Appel, C. Bowles, and T. Parrill, Ibid. p. 13.

    Google Scholar 

  30. K. Mizobuchi, K. Hamamoto, M. Utsugi, G.A. Dixit, S. Poarch, R.H. Havemann, C D. Dobson, A.I. Jeffryes, P.J. Holverson, Paul Rich, D.C. Butler, Nick Rimmer, and Arthur McGeow, Ibid. (1995) p. 45.

    Google Scholar 

  31. S.W. Chow, W.E. Loeb, and C.E. White, J. Appl. Polym. Sci. 13 (1969) p. 2235

    Google Scholar 

  32. Electronic Packaging Materials Science VI, edited by P.S. Ho, K.A. Jackson, C-Y. Li, and G.F. Lipscomb (Mater. Res. Soc. Symp. Proc. 264, Pittsburgh, 1992) p. 83.

    Google Scholar 

  33. J. Wary, R. Olson, and W. Beach, Semicond. Int. 19 (1996) p. 211.

    Google Scholar 

  34. J. Gaynor, J. Chen, H. Nguyen, G. Brown, K. Taylor, J.D. Luttmer, M.A. Piano, T. Cleary, J. Wing and J. Kelly, in Proc. Low and High Dielectric Constant Materials (Electrochemical Society, Montreal, 1997).

    Google Scholar 

  35. A. Harrus, J. Kelly, D. Kumar, T. Mountsier, and M.A. Piano, presented at the 52nd Symposium on Semiconductors and Integrated Circuits Technology (Electrochemial Society, Japan, June 1997).

    Google Scholar 

  36. P.K. Wu, G-R. Yang, J.F. MacDonald, and T-M. Lu, J. Electron. Mater. 24 (1995) p. 53.

    Google Scholar 

  37. A.S. Harrus, M.A. Piano, D. Kumar, and J. Kelly, in Electronic Materials and Processing, Semiconductors, Thin Films and Interfaces, edited by K. Uram, H. Treichel, A.C. Jones, and A. Lagendijk (Mater. Res. Soc. Symp. Proc. 443, Pittsburgh, 1997).

Download references

Authors
  1. R. Scott List
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Abha Singh
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Andrew Ralston
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Girish Dixit
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

List, R.S., Singh, A., Ralston, A. et al. Integration of Low-k Dielectric Materials Into Sub-0.25-μm Interconnects. MRS Bulletin 22, 61–69 (1997). https://doi.org/10.1557/S0883769400034229

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/S0883769400034229

Search

Navigation