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References
M.T. Bohr, Int. Electron Devices Meeting Tech. Digest (1995) p. 241.
D.C. Edelstein, G.A. Sai-Halasz, and Y-J. Mii, IBM J. Res. Dev. 39 (4) (1995) p. 383.
S.R. Wilson and C.J. Tracy, eds., Handbook of Multilevel Metallization for Integrated Circuits (Noyes Publications, Park Ridge, NJ, 1993).
J. Paraszczak, D. Edelstein, S. Cohen, E. Babich, and J. Hummel, Int. Electron. Devices Meeting Tech. Digest (1993) p. 261.
J.M.E. Harper, E.G. Colgan, C-K. Hu, J.P. Hummel, L.P. Buchwalter, and C.E. Uzoh, MRS Bulletin XIX (8) (1994) p. 23.
S. Murarka, Solid State Technol. 39 (3) (1996) p. 83.
J.L. Hedrick, J.W. Labadie, T.P. Russell, D.C. Hofer, and V. Wakharkar, Polymer 34 (1993) p. 4717.
J.A. Moore, C-I. Lang, T-M. Lu, and G-R. Yang, Vapor-Depositable Polymers with Low Dielectric Constants (American Chemical Society, Washington, DC, 1995) p. 4717.
R. Fox and J. P. Pellerin (private communication).
J.P. Hummel, in DuPotit Symp. Polyimides in Microelectronics, edited by C.S. Schuckert (DuPont, Wilmington, DE, 1995) p. 547.
P.S. Ho, T.W. Poon, and J. Leu, J. Phys. Chem. Solids 55 (10) (1994) p. 1115.
J. Leu, Y-S. Kang, H.C. Liou, and P.S. Ho, in Electronic Packaging Materials Science VII, edited by P. Borgesen, K.F. Jensen, and R.A. Pollak (Mater. Res. Soc. Symp Proc. 333, Pittsburgh, 1994) p. 283.
T.W. Poon, J. Leu, Y-S. Kang, H.C. Liou, and P.S. Ho, ibid. (1994) p. 333.
M. Ree, K-J. Chen, and D.P. Kirby, J. Appl. Phys. 72 (5) (1992) p. 2014.
M. Ree, K. Kim, S.H. Woo, and H. Chang, Ibid. 81 (2) (1997) p. 698.
R.F. Saraf, H-M. Tong, T.W. Poon, B.D. Silverman, P.S. Ho, and A.R. Rossi, J. Appl. Polym. Sci. 46 (1992) p. 1329.
C.W. Frank, V. Rao, M.M. Despotopoulou, R.F.W. Pease, W.D. Hinsberg, R.D. Miller, and J.F. Rabolt, Science 273 (1996) p. 912.
S.T. Chen, C.H. Yang, F. Faupel, and P.S. Ho, J. Appl. Phys. 64 (1988) p. 6690.
G. Hougham, G. Tesoro, and J. Shaw, Macromolecules 27 (1994) p. 3642.
H.M. Tong and K.L. Saenger, in Nezv Characterization Techniques for Thin Polymer Films (John Wiley & Sons, New York, 1990) p. 29.
C. Lu and A.W. Czandernal,eds., Applications of Piezoelectric Quartz Crystal Microbalances (Elsevier, Amsterdam, 1984).
G. Hougham, G. Tesoro, A. Viehbeck, and J.D. Chapple-Sokol, Macromolecules 27 (1994) p. 5964.
M.S.A. Deutsch, M-H. Ree, C.W. Surovic, G. Arjavalingam, K. Prasad, D.C. McHerron, M. McAllister, G.V. Kopcsay, A.P. Giri, E. Perfecto and G.E. White, IEEE Trans. Components, Packaging, Manufacturing Technol. B 17 (4) (1994) p. 486.
D.W.V. Krevelen, Properties of Polymers (Elsevier, New York, 1990).
R.B. Seymour and C.E. Carraher, Structure-Property Relationships in Polymers (Plenum Press, New York, 1984).
D. Baeriswyl, G. Harbeke, H. Kiess, and W. Meyer, in Electronic Properties of Polymers (John Wiley & Sons, New York, 1982).
S. Lee and J-W. Park, J. Appl. Phys. 80 (9) (1996) p. 5260.
R.C. Weast, ed., CRC Handbook of Chemistry and Physics (CRC Press, Inc., Boca Raton, FL, 1985).
L. Lin and S.A. Bidstrup, J. Appl. Polym. Sci. 54 (1994) p. 553.
A.J. McKerrow, J. Leu, H-M. Ho, B.C. Auman, and P.S. Ho, in Advanced Metallization and Interconnect Systems for ULS1 Applications in 1996, edited by Robert Havemann, John Schmitz, Hiroshi Komiyama, and Kazuo Tsubouchi (Materials Research Society, 1996).
P.E. Cassidy, Thermally Stable Polymers (Marcel Dekker, Inc., New York, 1980).
B.L. Joesten, J. Appl. Polym. Sci. 18 (1974) p. 439.
J. Kasthurirangan, C.N. Liao, J. Leu. and P. S. Ho (private communication).
T.W. Poon, B.D. Silverman, R. Saraf, A. Rossi, and P.S. Ho, Phys. Rev. 46 (18) (1992) p. 456.
C.R. Moylan, M.E. Best, and M. Ree, Polym. Phys. Ed. B29 (1991) p. 87
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Ryan, E.T., McKerrow, A.J., Leu, J. et al. Materials Issues and Characterization of Low-k Dielectric Materials. MRS Bulletin 22, 49–54 (1997). https://doi.org/10.1557/S0883769400034205
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DOI: https://doi.org/10.1557/S0883769400034205