Skip to main content
SpringerLink
Log in

Low-Dielectric-Constant Materials for ULSI Interlayer-Dielectric Applications

  • Low-Dielectric-Constant Materials
  • Published:
MRS Bulletin Aims and scope Submit manuscript

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

References

  1. D.C. Edelstein, G.A. Sai-Halasz, and Y-J. Mii, IBM J. Res. Dev. 39 (4) (1995) p. 383.

    Google Scholar 

  2. S.R. Wilson and C.J. Tracy, edsv Handbook of Multilevel Metallization for Integrated Circuits (Noyes Publications, Park Ridge, NJ, 1993).

    Google Scholar 

  3. J.G. Ryan, R.M. Geffken, N.R. Poulin, and J.R. Paraszczak, IBM. J. Res. Dev. 39 (4) (1995) p. 371.

    Google Scholar 

  4. M.T. Buhr, in Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, edited by R. Havemann, J. Schmitz, H. Komiyama, and K. Tsubouchi (Mater. Res. Soc. Symp. Proc, Pittsburgh, 1996) p. 3.

  5. The National Technology Roadmap for Semiconductors (Semiconductor Industry Association, San Jose, CA, 1994).

  6. M. Bohr, Tech. Digest IEEE Int. Electron. Devices Meeting 1995, p. 241.

    Google Scholar 

  7. S-P. Jeng, R. Havemann, and M. Chang, in Advanced Metallization for Devices and Circuits — Science, Technology, and Manufacturability, edited by S.P. Murarka, A. Katz, K.N. Tu, and K. Maex (Mater. Res. Soc. Symp. Proc. 337, Pittsburgh, 1994) p. 25.

  8. S-P. Jeng, M. Chang, T. Kroger, P. McAnally, and R. Havemann, VLSI Tech. Symp. Tech. Dig. (1994) p. 73.

    Google Scholar 

  9. Y. Nishiyama, R. Nakata, N. Hayasaka, H. Okano, R. Aoki, T. Nagamatsu, A. Satoh, M. Toyosaki, and H. Ito, U.S. Patent No. 5,429,995 (1995).

    Google Scholar 

  10. J. Fleming, E. Roherty-Osmun, and A. Farino, in Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, edited by R. Havemann, J. Schmitz, H. Komiyama, and K. Tsubouchi (Materials Research Society, Pittsburgh, 1997) p. 471.

  11. W.W. Lee et al., in Proc. SEMATECH Low Dielectric Const. Mater. Interconnect Workshop (SEMATECH, Austin, TX, 1996) p. 261.

    Google Scholar 

  12. C. Labelle, S. Limb, and K. Gleason, 3rd DUMICProc. 1997, p. 98.

    Google Scholar 

  13. R. Timmons and L. Han (private communication).

  14. C.H. Ting and T.E. Seidel, in Low-Dielectric Constant Materials—Synthesis and Applications in Microelectronics, edited by T-M. Lu, S.P. Murarka, T.S. Kuan, and C.H. Ting (Mater. Res. Soc. Symp. Proc. 381, Pittsburgh, 1995) p. 3.

  15. SEMATECH material presented at SEMATECH Low Dielectric Constant Materials and Interconnects Workshop, San Diego, May 1, 1996.

  16. P. Singer, Semicond. Int. (1996) p. 88.

    Google Scholar 

  17. W. Hunter, Tech. Digest IEEE Int. Electron. Devices Meeting 1995 5 p. 483.

    Google Scholar 

  18. C. Jin, L Ting, K. Taylor, T. Seha, and J. Luttmer, in Proc. 2nd Int. Dielectric for VLSI/ULSI Multilayer Interconnect Conf. (DUMIC) (Tampa, FL, 1996) p. 21.

    Google Scholar 

  19. A. Griffin, F. Brotzen, and P. Loos, J. Appl. Phys. 76 (1994) p. 4007.

    Google Scholar 

  20. A. Hurd, MRS Bulletin 21 (7) (1996) p. 11.

    Google Scholar 

  21. R. Weast, ed., CRC Handbook of Chemistry and Physics, 67th ed. (CRC Press, Inc., Boca Raton, FL, 1986).

    Google Scholar 

  22. W. Shih, J. Levine, and M. Chang, in Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, edited by R. Havemann, J. Schmitz, H. Komiyama, and K. Tsubouchi (Materials Research Society, Pittsburgh, 1997) p. 479.

  23. S. Jeng, K. Taylor, C. Lee, L. Ting, M. Chang, T. Seha, M. Eissa, H. Nguyen, C. Jin, A. Lane, P. McAnally, R. Havemann, and J. Luttmer, ibid, in 1995, edited by R. Ellwanger and S. Wang (Materials Research Society, Pittsburgh, 1996) p. 15.

  24. W.W. Lee, M. Jain, K. Taylor, R. Havemann, and J. Luttmer, presented at Symposium H, Materials Research Society Meeting, Boston, December 2, 1996.

    Google Scholar 

  25. M. Jain, K. Taylor, G. Dixit, W. Lee, L. Ting, G. Shinn, S. Nag, R. Havemann, and J. Luttmer, in Proc. VMIC Conf. (Tampa, FL, 1996) p. 23.

    Google Scholar 

  26. For example, see Low-Dielectric Constant Materials — Synthesis and Applications in Microelectronics, edited by T-M. Lu, S.P. Murarka, T.S. Kuan, and C.H. Ting (Mater. Res. Soc. Symp. Proc. 381, Pittsburgh, 1995)

  27. Loiv-Dielectric Constant Materials II, edited by K. Uram, H. Treichel, A.C. Jones, and A. Lagendijk (Mater. Res. Soc. Symp. Proc. 443, Pittsburgh, 1997)

    Google Scholar 

  28. Low-Dielectric Constant Materials III. edited by C. Case, P. Kohl, T. Kikkawa, and W.W. Lee (Mater. Res. Soc. Symp. Proc. 476, Pittsburgh, 1997).

    Google Scholar 

  29. For example, see Proceedings from the Loio Dielectric Constant Materials and Interconnects Workshop (SEMATECH, Austin, TX, 1996).

  30. For example, see Proc. Int. Dielectric for VLSI/ULSI Multilayer Interconnect Conf. (DUMIC) (Tampa, FL, 1995); Proc. 2nd DUMIC (Tampa, FL, 1996); Proc. 3rd DUMIC (Tampa, FL, 1997).

Download references

Authors
  1. Wei William Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Paul S. Ho
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Lee, W.W., Ho, P.S. Low-Dielectric-Constant Materials for ULSI Interlayer-Dielectric Applications. MRS Bulletin 22, 19–27 (1997). https://doi.org/10.1557/S0883769400034151

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/S0883769400034151

Search

Navigation