Skip to main content
Log in

Beyond “Smart-Cut®”: Recent Advances in Layer Transfer for Material Integration

  • Published:
MRS Bulletin Aims and scope Submit manuscript

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

References

  1. M. Bruel, Electron. Lett. 31 (1995) p. 1201.

    Google Scholar 

  2. L. Di Cioccio, Y. Le Tiec, F. Letertre, C. Jaussaud, and M. Bruel, ibid. 32 (12) (1996) p. 1144.

    Google Scholar 

  3. E. Jalaguier, B. Aspar, S. Pocas, J.F. Michaud, M. Zussy, A.M. Papon, and M. Bruel, ibid. 34 (4) (1998) p. 408.

    Google Scholar 

  4. Q-Y. Tong, K. GutJahr, S. Hopfe, U. Gösele, and T-H. Lee, Appl. Phys. Lett. 70 (1997) p. 1390.

    Google Scholar 

  5. M.K. Weldon, V.E. Marsico, Y.J. Chabal, A. Agarwal, D.J. Eaglesham, J. Sapjeta, W.L. Brown, D.C. Jacobson, Y. Caudano, S.B. Christman, and E.E. Chaban, in Proc. Fourth Int. Symp. on Semiconductor Wafer Bonding: Science, Technology and Applications, vol. 97-36 (Electrochemical Society, Pennington, NJ, 1998) p. 229.

    Google Scholar 

  6. Q-Y. Tong, T-H. Lee, L-J. Huang, Y-L. Chao, W.J. Kim, R. Scholz, T-Y. Tan, and U. Gösele, ibid., vol. 97-36, edited by S.H. Grösele, H. Baumgart, T. Abe, C. Hunt, and S. Iyer (Electrochemical Society, Pennington, NJ, 1998) p. 521.

    Google Scholar 

  7. M. Bruel, U.S. Patent No. 5,374,564 (December 20, 1994).

    Google Scholar 

  8. Q-Y. Tong, R. Scholtz, U. Gösele, T-H. Lee, L-J. Huang, Y-L. Chao, and T-Y. Tan, Appl. Phys. Lett. 72 (1) (1998) p. 49.

    Google Scholar 

  9. C.G. Van der Walle, Phys. Rev. B 49 (1994) p. 4579.

    Google Scholar 

  10. S.J. Pearton, J.W. Corbett, and T.S. Shi, Appl. Phys. A 43 (1987) p. 153.

    Google Scholar 

  11. G.F. Cerofolini, R. Balboni, D. Bisero, F. Corni, S. Frabboni, G. Ottaviani, R. Tonini, R.S. Brusa, A. Zecca, M. Ceschini, G. Giebel, and L. Pavesi, Phys. Status Solidi A 150 (1995) p. 539.

    Google Scholar 

  12. Q-Y. Tong, L-J. Huang, Y-L. Chao, A. Ploessl, and U. Gösele, in Proc. 1998 IEEE Int. SOI Conf. (October 1998) p. 143.

    Google Scholar 

  13. P.J.H. Denteneer, C.G. Van der Walle, and S.T. Pantelides, Phys. Rev. B 39 (1989) p. 10809.

    Google Scholar 

  14. J.T. Borenstein, J.W. Corbett, and S.J. Pearton, J. Appl. Phys. 73 (1993) p. 2751.

    Google Scholar 

  15. G. Hess, P. Parkinson, B. Gong, Z. Xu, D. Lim, M. Downer, S. John, S. Banerjee, and J.G. Ekerdt, Appl. Phys. Lett. 71 (1997) p. 2184.

    Google Scholar 

  16. R.W. Bower, L. LeBoeuf, and Y.A. Li, Il Nuovo Cimento 19, D, N. 12 (1997) p. 1871.

    Google Scholar 

  17. A.D. Marwick, G.S. Oehrlein, and M. Wittmer, Appl. Phys. Lett. 59 (2) (1991) p. 198.

    Google Scholar 

  18. A. Agarwal, T.E. Haynes, V.C. Venezia, O.W. Holland, and D.J. Eaglesham, ibid. 72 (9) (1998) p. 1086.

    Google Scholar 

  19. Q-Y. Tong, T-H. Lee, L-J. Huang, Y-L. Chao, and U. Gösele, Electron. Lett. 34 (1998) p. 407.

    Google Scholar 

  20. L.B. Freund, Appl. Phys. Lett. 70 (1997) p. 3519.

    Google Scholar 

  21. L-J. Huang, Q-Y Tong, T-H. Lee, Y-L. Chao, and U. Gösele, in Proc. 8th Int. Symp. Silicon Materials Science and Technology, vol. 98-1, edited by H.R. Huff, H. Tsuya, and U. Gösele (Electrochemical Society, Pennington, NJ, 1998) p. 1373.

    Google Scholar 

  22. R.W. Bower and Y.A. Li, to be published.

  23. Q-Y. Tong, T-H. Lee, L-J. Huang, Y-L. Chao, and U. Gösele, to be published.

  24. R.W. Bower, M.S. Ismail, and B.E. Roberds, Appl. Phys. Lett. 28 (1993) p. 2485.

    Google Scholar 

  25. R.W. Bower, M.S. Ismail, U.S. Patent No. 5,503,704 (1996).

    Google Scholar 

  26. Y.A. Li and R.W. Bower, Jpn. J. Appl. Phys. 37 (3) (1998) p. 737.

    Google Scholar 

  27. R.W. Bower and Y.A. Li, in Proc. SP1E, Vol. 3184 (1997) p. 2.

    Google Scholar 

  28. Y.A. Li and R.W. Bower, Jpn. J. Appl. Phys. In press.

  29. A. J. Auberton-Hervé, M. Bruel, B. Aspar, C. Maleville, and H. Moriciau, Smart-Cut®: IEICE Trans. Electron., vol. E80-C.3, March 1997.

  30. R.W. Bower, Patent Applied for 1997.

    Google Scholar 

Download references

Authors

Rights and permissions

Reprints and permissions

About this article

Cite this article

Tong, QY., Bower, R.W. Beyond “Smart-Cut®”: Recent Advances in Layer Transfer for Material Integration. MRS Bulletin 23, 40–44 (1998). https://doi.org/10.1557/S0883769400029821

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/S0883769400029821

Navigation