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Wafer-Bonding and Thinning Technologies

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Authors
  1. Cynthia A. Desmond-Colinge
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  2. Ulrich Gösele
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Desmond-Colinge, C.A., Gösele, U. Wafer-Bonding and Thinning Technologies. MRS Bulletin 23, 30–34 (1998). https://doi.org/10.1557/S0883769400029808

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