Abstract
Molecular Dynamics simulations were performed to study Cu film deposition on β-Ta. Three different β-Ta surfaces were used, two being atomically flat, and one resulting from Ta on Ta growth. We find that the Cu films develop a (111) texture with vertical grain boundaries between grains having different epitaxial relations with the β-Ta substrate. The epitaxial rotation angles were determined, as 5.2° and 10-13°, and the resulting strain reductions in the Cu films were identified. The effects of the substrate differences on the interfacial Ta/Cu intermixing and the epitaxy and grain boundary structure of the films are discussed.
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References
T. P. C. Klaver and B. J. Thijsse, Thin Solid Films (2002) (in press).
T. P. C. Klaver and B. J. Thijsse, Mat. Res. Soc. Symp. Proc. 504 (1998) 51.
R. A. Johnson and D. J. Oh, J. Mater. Res. 4 (1989) 1195.
D. J. Oh and R. A. Johnson, “Simple embedded atom method model for fcc and hcp metals,” Atomistic Simulations of Materials: beyond Pair Potentials, ed. V. Vitec and D. J. Srolovitz, pp. 233-238.
R. A. Johnson, Phys. Rev. B 41 (1990) 9717.
F. R. de Boer, R. Boom, W. C. M. Mattens, A. R. Miedema, and A. K. Niessen, Cohesion in metals, ed. F. R. de Boer and D. Pettifor (North Holland Physics Publishing 1989) p. 544.
P.T. Moseley and C.J. Seabrook, Acta Cryst. B 29 (1973) 1170.
K. Kwon, C. Ryu, R. Sinclair, and S. Wong, Appl. Phys. Lett. 71 (1997) 3069.
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Klaver, P., Thijsse, B.J. Molecular Dynamics Study of Cu Thin Film Deposition onβ-Ta. MRS Online Proceedings Library 721, 23 (2002). https://doi.org/10.1557/PROC-721-J2.3
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DOI: https://doi.org/10.1557/PROC-721-J2.3