Abstract
A deposition process has been developed which allows the growth of large grain (20+ μm) polysilicon films on SiO2 substrates at a growth temperature of 650° C. A thin layer of liquid Si-metal solution is formed on the substrate surface as the growth medium. This layer is kept saturated by Si flux from a DC magnetron sputter gun. XRD analysis of the deposited films show a strong (111) preferred orientation, with increasing integrated peak intensities with increasing depositon temperature and solution layer thickness. Films deposited using an In-Si solution are p-type, with carrier concentrations in the mid 1016 cm−3 range. Conductivities of ∼.2 (Ω cm)−1 were measured, with activation energies for both carrier generation and conductivity of about 135meV. The hole mobility was found to be ∼ 30 cm2 V−1s−1. A wetting layer is used which may have a detrimental effect on the minority carrier lifetime.
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Wallace, R.L., Anderson, W.A. & Jones, K.M. Thin Film Polycrystalline Si by Cs Solution Growth Technique. MRS Online Proceedings Library 358, 883 (1994). https://doi.org/10.1557/PROC-358-883
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DOI: https://doi.org/10.1557/PROC-358-883