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Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements

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Abstract

Electroless nickel (Ni-P) is a common surface finish used in the ball grid array (BGA) package and interfacial reactions between its surface finish and lead-free solders can form complex intermetallic compound (IMC) layers. The presence of minor elements in lead-free solders either intentionally added or due to impurity contamination during solder manufacturing, can affect the solder-joint performance. In this work, interfacial reactions between Ni-P surface finish and the Sn-Ag-Cu solders were modified by varying Ag and Cu contents and also by adding a small amount of minor elements such as phosphorus (P), indium (In), and germanium (Ge). A transmission electron microscope was used to determine the intermetallic layer phases, compositions, crystal structures, and void defects. Varying the solder alloy elements led to the modulation of voids formation.

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Authors and Affiliations

  1. Intel Malaysia, Kulim Hi-Tech 2/3, 09000, Kulim, Malaysia

    Y. T. Chin & P. K. Lam

  2. Faculty of Engineering, Multimedia University, 63100, Cyberjaya, Selangor, Malaysia

    H. K. Yow & T. Y. Tou

Authors
  1. Y. T. Chin
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  2. P. K. Lam
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  3. H. K. Yow
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  4. T. Y. Tou
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Correspondence to P. K. Lam.

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Chin, Y.T., Lam, P.K., Yow, H.K. et al. Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements. Journal of Materials Research 25, 1304–1311 (2010). https://doi.org/10.1557/JMR.2010.0181

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  • DOI: https://doi.org/10.1557/JMR.2010.0181

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