Abstract
This investigation elucidates stress evolution in situ in tin strips under electromigration using synchrotron radiation x-ray. Minute variations in stress are determined precisely using intense x-rays. Back stresses gradient with the values of 5.5 and 16.5 MPa/cm, which are induced by the current densities of 1 × 103 and 5 × 103 A/cm2, respectively, are measured directly. The effective diffusivities that include both grain and lattice diffusion at various current densities are determined. The Joule heating is observed, ranging from 5 to 15 °C, according to various current densities passed through the stripes. Results of this study suggest that the protective oxide layer on the surfaces significantly influences the kinetics of stress evolution.
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C.K. Hu, J.M.E. Harper Copper interconnections and reliability. Mater. Chem. Phys. 52, 5 (1998)
P.S. Ho, T. Kwok Electromigration in metals. Rep. Prog. Phys. 52, 301 (1989)
K.N. Tu Recent advances on electromigration in very-large-scale-integration of interconnects. J. Appl. Phys. 94, 5451 (2003)
I.A. Blech, C. Herring Stress generation by electromigration. Appl. Phys. Lett. 29, 131 (1976)
P.C. Wang, G.S. Cargill III, I.C. Noyan, C.K. Hu Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction. Appl. Phys. Lett. 72, 1296 (1998)
H.K. Kao, G.S. Cargill III, F. Giuliani, C.K. Hu Relationship between copper concentration and stress during electromigration in an Al(0.25 at.% Cu) conductor line. J. Appl. Phys. 93, 2516 (2003)
M.A. Korhonen, P. Børgesen, K.N. Tu, C.Y. Li Stress evolution due to electromigration in confined metal lines. J. Appl. Phys. 73, 3790 (1993)
M. Shatzkes, J.R. Lloyd A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2. J. Appl. Phys. 59, 3890 (1986)
J.J. Clement, C.V. Thompson Modeling electromigration-induced stress evolution in confined metal lines. J. Appl. Phys. 78, 900 (1995)
N. Tamura, R.S. Celestre, A.A. MacDowell, H.A. Padmore, R. Spolenak, B.C. Valek, Meier N. Chang, A. Manceau, J.R. Patel Submicron x-ray diffraction and its applications to problems in materials and environmental science. Rev. Sci. Instrum. 73, 1369 (2002)
Z. Suo Electromigration-induced dislocation climb and multiplication in conducting lines. Acta Metall. Mater. 42, 3581 (1994)
R. Kirchheim Stress and electromigration in Al-lines of integrated circuits. Acta Metall. Mater. 40, 309 (1992)
C.K. Hu, K.P. Rodbell, T.D. Sullivan, K.Y. Lee, D.P. Bouldin Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM J. Res. Develop. 39, 465 (1995)
A.T. Wu, K.N. Tu, J.R. Lloyd, N. Tamura, B.C. Valek, C.R. Kao Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction. Appl. Phys. Lett. 85, 2490 (2004)
A. Lee, W. Liu, C.E. Ho, K.N. Subramanian Synchrotron x-ray microscopy studies on electromigration of a two-phase material. J. Appl. Phys. 102, 053507 (2007)
K.N. Tu Solder Joint Technology (Springer, New York 2007) Chap. 9
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Wu, A.T., Siao, CN., Ku, CS. et al. In situ observation of stress evolution in pure tin strip under electromigration using synchrotron radiation x-ray. Journal of Materials Research 25, 292–295 (2010). https://doi.org/10.1557/JMR.2010.0029
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DOI: https://doi.org/10.1557/JMR.2010.0029