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Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

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Abstract

Electrical conductivity of electronic interconnects made with Sn-based solders undergo a significant amount of deterioration during service. Several factors, such as anisotropy of Sn, coefficient of thermal expansion mismatches between the entities that make up the joint, and growth of intermetallic compounds present within the solder and solder/substrate interface, may contribute to the damage accumulation during thermal excursions and cause deterioration of properties. This study dealing with effects of aging and thermal shock on electrical conductivity, carried out with bulk Sn, and eutectic Sn–Ag in bulk and joint configurations, is aimed at evaluating the roles of the above factors on the deterioration of electrical conductivity from these thermal excursions.

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References

  1. C.M.L. Wu and M.L. Huang: Creep behavior of eutectic Sn–Cu lead-free solder alloy, J. Electron. Mater. 31, 442 (2002).

    Article  CAS  Google Scholar 

  2. D.R. Frear, J.W. Jang, J.K. Lin and C. Zhang: Pb-free solders for flip-chip interconnects, JOM 53, 28 (2001).

    Article  CAS  Google Scholar 

  3. S.K. Kang and T.G. Ference: Nickel-alloyed tin-lead eutectic solder for surface mount technology, J. Mater. Res. 8, 1033 (1993).

    Article  CAS  Google Scholar 

  4. H. Takao and H. Hasegawa: Influence of alloy composition on fillet-lifting phenomenon in tin binary alloys, J. Electron. Mater. 30, 1060 (2001).

    Article  CAS  Google Scholar 

  5. C.S. Oh, J.H. Shim, B.J. Lee, D.N. Lee: A thermodynamic study on the Ag-Sb-Sn system, J. Alloys Compd. 238, 155 (1996).

    Article  CAS  Google Scholar 

  6. S.M. Hong, J.Y. Park, C.S. Kang and J.P. Jung: Fluxless wetting properties of UBM-coated Si-wafer to Sn-3.5wt%Ag solder, IEEE. T. Compon. Pack. T. 26, 255 (2003).

    Article  CAS  Google Scholar 

  7. M. Nishiura, A. Nakayama, S. Sakatani, Y. Kohara, K. Uenishi and K.F. Kobayashi: Mechanical strength and microstructure of BGA joints using lead-free solders, Mater. Trans. 43, 1802 (2002).

    Article  CAS  Google Scholar 

  8. Y. Fujiwara, H. Enomoto, T. Nagao and H. Hoshika: Composite plating of Sn–Ag alloys for Pb-free soldering, Surf. Coat. Technol. 169, 100 (2003).

    Article  CAS  Google Scholar 

  9. K.N. Subramanian and J.G. Lee: Physical metallurgy in lead-free electronic solder development, JOM 55, 26 (2003).

    Article  Google Scholar 

  10. H.T. Lee, M.H. Chen, H.M. Jao and T.L. Liao: Influence of interfacial intermetallic compound on fracture behavior of solder joints, Mater. Sci. Eng. A-Struct. 358, 134 (2003).

    Article  CAS  Google Scholar 

  11. X. Ma, F.J. Wang, Y.Y. Qian and F. Yoshida: Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface, Mater. Lett. 57, 361 (2003).

    Google Scholar 

  12. Y.D. Jeon, S. Nieland, A. Ostmann, H. Reichl and K.W. Paik: A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy, J. Electron. Mater. 32, 548 (2003).

    Article  CAS  Google Scholar 

  13. C.H. Yu, K.S. Kim, Y.B. Sun, N.K. Kim, N.H. Kim, H.S. Oh and E.G. Chang: Shear strength in solder bump joints for high reliability photodiode packages, Mater. Trans. 43, 3234 (2002).

    Article  CAS  Google Scholar 

  14. Y.C. Chan, S.H. Fan and J.K.L. Lai: Open defects in PBGA assembly solder joints, J. Electron. Packaging 125, 153 (2003).

    Article  CAS  Google Scholar 

  15. K.S. Kim, S.H. Huh and K. Suganuma: Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu, Microelectron. Reliab. 43, 259 (2003).

    Article  CAS  Google Scholar 

  16. C.M.L. Wu, D.Q. Yu, C.M.L. Law and L. Wang: Improvements of microstructure, wettability, tensile and creep strength of eutectic Sn-Ag alloy by doping with rare-earth elements, J. Mater. Res. 17, 3146 (2002).

    Article  CAS  Google Scholar 

  17. M. Dittes and H. Walter: Advanced alloy for lead-free solder balls, Solder. Surf. Mt. Tech. 15, 50 (2003).

    Article  CAS  Google Scholar 

  18. J.W. Choi, H.S. Cha and T.S. Oh: Mechanical properties and shear strength of Sn-3.5Ag-Bi solder alloys, Mater. Trans. 43, 1864 (2002).

    Article  CAS  Google Scholar 

  19. C. Kanchanomai, Y. Miyashita, Y. Mutoh and S.L. Mannan: Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn-3.5Ag, Mater. Sci. Eng. A-Struct. 345, 90 (2003).

    Article  Google Scholar 

  20. J. Lau, Z. Mei, S. Pang, C. Amsden, J. Rayner and S. Pan: Creep analysis and thermal-fatigue life prediction of the lead-free solder sealing ring of a photonic switch, J. Electron. Packaging 124, 403 (2002).

    Article  Google Scholar 

  21. S. Ahat, W.D. Huang, S. Mei and L. Le: Joint shape, microstructure, and shear strength of lead-free solder joints with different component terminations, J. Electron. Mater. 31, 136 (2002).

    Article  CAS  Google Scholar 

  22. K.P. Wu, N. Wade, J. Cui and K. Miyahara: Microstructural effect on the creep strength of a Sn-3.5%Ag solder alloy, J. Electron. Mater. 32, 5 (2003).

    Article  CAS  Google Scholar 

  23. R.J. McCabe and M.E. Fine: High creep resistance tin-based alloys for soldering applications, J. Electron. Mater. 31, 1276 (2002).

    Article  CAS  Google Scholar 

  24. S.H. Huh, K.S. Kim and K. Suganuma: Effect of Ag addition on the microstructural and mechanical properties of Sn-Cu eutectic solder, Mater. Trans. 42, 739 (2001).

    Article  CAS  Google Scholar 

  25. K. Sasaki, A. Yanagimoto and H. Ishikawa: Viscoplastic deformation of lead-free solder alloy—experiments and simulations, Key. Eng. Mater. 233, 779 (2003).

    Article  Google Scholar 

  26. H. Takao and H. Hasegawa: Influence of alloy composition on fillet-lifting phenomenon in tin binary alloys, J. Electron. Mater. 30, 1060 (2001).

    Article  CAS  Google Scholar 

  27. Z.D. Xia, Z.G. Chen, Y.W. Shi, N. Mu and N. Sun: Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder, J. Electron. Mater. 31, 564 (2002).

    Article  CAS  Google Scholar 

  28. S. Choi, J.P. Lucas, K.N. Subramanian and T.R. Bieler: Formation and growth of interfacial intermetallic layers in eutectic Sn-Ag solder and its composite solder joints, J. Mater. Sci. Mater. El. 11, 497 (2000).

    Article  CAS  Google Scholar 

  29. F. Guo, J.G. Lee, S. Choi, J.P. Lucas, T.R. Bieler and K.N. Subramanian: Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles, J. Electron. Mater. 30, 1073 (2001).

    Article  CAS  Google Scholar 

  30. S.Y. Hwang, J.W. Lee and Z.H. Lee: Microstructure of a lead-free composite solder produced by anin-situ process, J. Electron. Mater. 31, 1304 (2002).

    Article  CAS  Google Scholar 

  31. S. Choi, J.G. Lee, K.N. Subramanian, J.P. Lucas and T.R. Bieler: Microstructural characterization of damage in thermomechanically fatigued Sn-Ag based solder joints, J. Electron. Mater. 31, 292 (2002).

    Article  CAS  Google Scholar 

  32. J.G. Lee, F. Guo, S. Choi, K.N. Subramanian, T.R. Bieler and J.P. Lucas: Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints, J. Electron. Mater. 31, 946 (2002).

    Article  CAS  Google Scholar 

  33. J.G. Lee, F. Guo, and K.N. Subramanian: Thermomechanical fatigue behavior of Pb-free automotive electronic solders, SAE Paper Number 2003-01-0621. (SAE 2003 World Congress, Detroit, MI, 2003).

    Google Scholar 

  34. J. Howell, A. Telang, J.G. Lee, S. Choi and K.N. Subramanian: Surface damage accumulation in Sn-Ag solder joints under large reversed strains, J. Mater. Sci. Mater. El. 13, 335 (2002).

    Article  CAS  Google Scholar 

  35. K.J. Ferguson, A. Telang, J.G. Lee and K.N. Subramanian: Microstructural effects on the behavior of Sn-Ag solder joints under repeated reverse stressing, J. Mater. Sci.-Mater. El. 14, 157 (2003).

    Article  CAS  Google Scholar 

  36. K.C. Chen, A. Telang, J.G. Lee and K.N. Subramanian: Damage accumulation under repeated reverse stressing of Sn-Ag solder joints, J. Electron. Mater. 31, 1181 (2002).

    Article  CAS  Google Scholar 

  37. J.G. Lee, A. Telang, K.N. Subramanian and T.R. Bieler: Modeling thermomechanical fatigue behavior of Sn-Ag solder joints, J. Electron. Mater. 31, 1152 (2002).

    Article  CAS  Google Scholar 

  38. K.N. Subramanian and J.G. Lee: Effect of anisotropy of tin on thermomechanical behavior of solder joints, J. Mater. Sci.-Mater. El. 15, 235 (2004).

    Article  CAS  Google Scholar 

  39. B.A. Cook, I.E. Adnderson, J.H. Harringa, R.L. Terpstra and S.K. Kang: Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity, J. Electron. Mater. 32, 1384 (2003).

    Article  CAS  Google Scholar 

  40. K.D. Kim and D.D.L. Chung: Effect of heating on the electrical resistivity of conductive adhesive and soldered joints, J. Electron. Mater. 31, 933 (2002).

    Article  CAS  Google Scholar 

  41. S. Choi, T.R. Bieler, J.P. Lucas and K.N. Subramanian: Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging, J. Electron. Mater. 28, 1209 (1999).

    Article  CAS  Google Scholar 

  42. F. Guo, J. Lee, J.P. Lucas, K.N. Subramanian and T.R. Bieler: Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles, J. Electron. Mater. 30, 1222 (2001).

    Article  CAS  Google Scholar 

  43. F. Guo, S. Choi, J.P. Lucas and K.N. Subramanian: Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders, Solder. Surf. Mt. Tech. 13, 7 (2001).

    Article  CAS  Google Scholar 

  44. A.W. Gibson, S. Choi, K.N. Subramanian and T.R. Bieler: Issues regarding microstructural coarsening due to aging of eutectic tin-silver solder. Reliability of Solders and Solder Joints, edited by R.K. Mahidhara, D.R. Frean, S.M.L. Sastry, K.L. Munty, P.K. Liaue, and W.L. Winterbottom (TMS, Warrendale, PA, 1997), p. 97.

    Google Scholar 

  45. H.E. Hedges: in Tin and its Alloys, 1st ed. (Edward Arnold, London, U.K., 1960), pp. 51–53.

    Google Scholar 

  46. Y. Kariya, N. Williams, C. Gagg and W. Plumbridge: Tin pest in Sn-0.5 wt% Cu lead-free solder, JOM 53, 39 (2001).

    Article  CAS  Google Scholar 

  47. Y. Kariya, C. Gagg and W. Plumbridge: Tin pest in lead-free solders, Solder. Surf. Mt. Tech. 13, 39 (2000).

    Article  Google Scholar 

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Authors and Affiliations

  1. Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan, 48824-1226, USA

    F. Guo, J. G. Lee & K. N. Subramanian

  2. Electrical and Computer Engineering Department, Michigan State University, East Lansing, Michigan, 48824-1226, USA

    T. Hogan

Authors
  1. F. Guo
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  2. J. G. Lee
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  3. T. Hogan
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  4. K. N. Subramanian
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Correspondence to K. N. Subramanian.

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Guo, F., Lee, J.G., Hogan, T. et al. Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock. Journal of Materials Research 20, 364–374 (2005). https://doi.org/10.1557/JMR.2005.0064

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  • DOI: https://doi.org/10.1557/JMR.2005.0064

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