Skip to main content
SpringerLink
Log in

Electromigration failure in flip chip solder joints due to rapid dissolution of copper

  • Rapid Communications
  • Published:
Journal of Materials Research Aims and scope Submit manuscript

Abstract

An electromigration failure mechanism in flip chip solder joints is reported in this communication. The solder joints failed by a very rapid, asymmetrical, and localized dissolution of the Cu metallization on the cathode side. The average dissolution rate was about 1 μm/min. The dissolved Cu included not only the Cu under bump metallurgy but also the on-chip Cu conducting trace. From the location and geometry of the dissolved Cu, it can be concluded that current crowding plays a critical role in the rapid dissolution. The dissolved Cu atoms were driven to the anode side by electromigration, and a large amount of Cu6Sn5 was formed there.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. S. Brandenberg and S. Yeh, in Proceedings of the 1998 Surface Mount International Conference and Exhibition (SMTA, Edina, MN, 1998), p. 337.

  2. K. Zeng and K.N. Tu, Mater. Sci. & Eng. R 38, 55 (2002).

    Article  Google Scholar 

  3. J.D. Wu, P.J. Zheng, K. Lee, C.T. Chiu, and J.J. Lee, in Proceedings of the 2002 Electronic Components and Technology Conference (IEEE, New York, 2002), p. 452.

  4. C.Y. Liu, C. Chen, C.N. Liao, and K.N. Tu, Appl. Phys. Lett. 75, 58 (1999).

    Article  CAS  Google Scholar 

  5. C.Y. Liu, C. Chen, and K.N. Tu, J. Appl. Phys. 88, 5703 (2000).

    Article  CAS  Google Scholar 

  6. Q.T. Huynh, C.Y. Liu, C. Chen, and K.N. Tu, J. Appl. Phys. 89, 4332 (2001).

    Article  CAS  Google Scholar 

  7. N.A. Gjostein, in Diffusion, edited by H.I. Aaronson (American Society for Metals, Metals Park, OH, 1973), Chapter 9, p. 241; see Fig. 15.

  8. P. Wynblatt and N.A. Gjostein, Surf. Sci., 12, 109 (1968).

    Article  CAS  Google Scholar 

  9. E.C.C. Yeh, W.J. Choi, K.N. Tu, P. Elenius, and H. Balkan, Appl. Phys. Lett. 80, 580 (2002).

    Article  CAS  Google Scholar 

  10. B.F. Dyson, T.R. Anthony, and D. Turnbull, J. Appl. Phys. 37, 2370 (1966).

    Article  CAS  Google Scholar 

  11. W.K. Warburton and D. Turnbull, in Diffusion in Solids: Recent Developments, edited by A.S. Nowick and J.J. Burton (Academic Press, New York, 1975) p. 171.

  12. C.K. Hu and H. Huntington, Phys. Rev. B 26, 2782 (1982).

    Article  CAS  Google Scholar 

  13. C.K. Hu and H. Huntington, Phys. Rev. B 28, 579 (1983).

    Article  CAS  Google Scholar 

  14. H. Ye, C. Basaran, and D. Hopkins, Appl. Phys. Lett. 82, 1045 (2003).

    Article  CAS  Google Scholar 

  15. W.G. Beder, Welding Research Supplement, 551-s (1969).

  16. A. Rahn, The Basics of Soldering (John Wiley & Sons, New York, 1993), p. 28.

  17. D. Gupta, K. Vieregge, and W. Gust, Acta Mater. 47, 5 (1999).

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Chemical and Materials Engineering, National Central University, Chungli City, Taiwan, Republic of China

    Y. C. Hu, Y. H. Lin & C. R. Kao

  2. Department of Materials Science and Engineering, University of California—Los Angeles, Los Angeles, California, 90095-1595, USA

    K. N. Tu

Authors
  1. Y. C. Hu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Y. H. Lin
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. C. R. Kao
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. K. N. Tu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to C. R. Kao.

Additional information

This author was an editor of this journal during the review and decision stage. For the JMR policy on review and publication of manuscripts authored by editors, please refer to http://www.mrs.org/publications/jmr/policy.html

Rights and permissions

Reprints and permissions

About this article

Cite this article

Hu, Y.C., Lin, Y.H., Kao, C.R. et al. Electromigration failure in flip chip solder joints due to rapid dissolution of copper. Journal of Materials Research 18, 2544–2548 (2003). https://doi.org/10.1557/JMR.2003.0355

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/JMR.2003.0355

Search

Navigation