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Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders

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Abstract

The interface microstructures of Sn-Ag and Sn-Ag-Cu solders with Au/Ni-6P plating were studied primarily using transmission electron microscopy. During soldering at 230°C, Au dissolved into molten solder, and double reaction layers of Ni3Sn4/η–Ni3SnP formed between Sn-3.5Ag solder and Ni-6P layer. P content increases in the surface region of the Ni-6P layer due to the depletion of Ni diffused into molten solder, resulting in the formation of Ni3P+Ni layer. For Sn-3.5Ag-0.7Cu solder, an η-(Ni,Cu)3Sn2 single layer, containing Cu of about 50 at.%, formed as a reaction layer.

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Authors and Affiliations

  1. Institute of Scientific and Industrial Research, Osaka University Mihogaoka 8-1, Ibaraki, Osaka, 567-0047, Japan

    Chi-Won Hwang & Katsuaki Suganuma

  2. C. Uyemura & Co., Ltd., Deguchi 1-5-1, Hirakata, Osaka, 573-0065, Japan

    Masayuki Kiso & Shigeo Hashimoto

Authors
  1. Chi-Won Hwang
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  2. Katsuaki Suganuma
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  3. Masayuki Kiso
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  4. Shigeo Hashimoto
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Correspondence to Chi-Won Hwang.

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Hwang, CW., Suganuma, K., Kiso, M. et al. Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders. Journal of Materials Research 18, 2540–2543 (2003). https://doi.org/10.1557/JMR.2003.0354

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  • DOI: https://doi.org/10.1557/JMR.2003.0354

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