Abstract
A novel experimental configuration was devised to measure the evolution of the deformation field and the corresponding toughness in solder joints for microelectronic packaging. The utilized material system comprised a ductile layer of tin-based solder encapsulated within relatively hard copper shoulders. The experimental configuration provided pure shear state within the constrained solder layer. Different Pb/Sn compositions were tested with grain size approaching the film thickness. The in-plane strain distribution within the joint thickness was measured by a microscopic digital image correlation system. The toughness evolution within such highly gradient deformation field was monitored qualitatively through a two-dimensional surface scan with a nanoindentor. The measurements showed a highly inhomogeneous deformation field within the film with discreet shear bands of concentrated strain. The localized shear bands showed long-range correlations of the order 2–3 grain diameters. A size-dependent macroscopic response on the layer thickness was observed. However, the corresponding film thickness was approximately 100–1000 times larger than those predicted by nonlocal continuum theories and discreet dislocation.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
J.W. Morris, F.J.L. Goldstein, and Z. Mei, in The Mechanics of Solder Alloy Interconnects, edited by D. Frear, H. Morgan, S. Burchett, and J. Lau (Chapman and Hall, New York, 1994).
C. Basaran and J. Jiang, Mech. Mater. 34, 349 (2002)
G.E. Dieter, Mechanical Metallurgy (McGraw-Hill, New York, 1981).
J.P. Ranieri, F.S. Lauten, and D.H. Avery, J. Electron. Mater. 24, 1419 (1995).
A.P. Green, J. Mech. Phys. Solids 2, 197 (1954).
A. Needleman, Acta Metall. 48, 105 (2000).
The Mechanics of Solder Alloy Interconnects, edited by D. Frear, H. Morgan, S. Burchett, and J. Lau (Chapman and Hall, New York, 1994).
V. Tvergaard and J. Hutchinson, J. Mech. Phys. Solids 40, 1377 (1992).
Surface Displacement Analysis User Manual (Instron, Canton, MA, 1997).
E.O. Brigham, The Fast Fourier Transform (Prentice-Hall, Englewood Cliffs, NJ, 1974).
D.J. Chen, F.P. Chiang, Y.S. Tan, and H.S. Don, Appl. Opt. 32, 1839 (1993).
A-F. Bastawros and R. McManuis, Exp. Tech. 22, 35 (1998).
A-F. Bastawros, H. Bart-Smith, and A.G. Evans, J. Mech. Phys. Solids 48, 301 (2000).
D. Tabor, Hardness of Metals (Oxford University Press, Oxford, U.K., 1951).
A-F. Bastawros and K-S. Kim, in Fracture and Ductile vs. Brittle Behavior, edited by G.E. Beltz, R.L. Blumberg Selinger, M.P. Marder, and K-S. Kim (Mater. Res. Soc. Symp. Proc. 539, Pittsburgh, PA, 1998), p. 251.
A-F. Bastawros and K-S. Kim, J. Mech. Phys. Solids 48, 67 (2000).
W. Callister, Material Science and Engineering, An Introduction (John Wiley & Sons, New York, 1999).
H.P. Meissner and E.W. Merrill, ASTM Bull. 151, 80 (1948).
Adhesion and Adhesives Science and Technology, edited by A.J. Kinloch (Chapman and Hall, London, U.K., 1987), p. 211.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Antoniou, A., Bastawros, A.F. Deformation characteristics of tin-based solder joints. Journal of Materials Research 18, 2304–2309 (2003). https://doi.org/10.1557/JMR.2003.0323
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/JMR.2003.0323