Abstract
A novel Ag/mica compressive seal was thermally cycled between 100 °C and 800 °C in air to evaluate its stability. The novel Ag/mica compressive seal was composed of a naturally cleaved Muscovite mica sheet and two thin silver layers, and was reported in a previous study to have very low leak rates at 800 °C. In the present study, we examined the thermal cycle stability of the Ag/mica-based compressive seals pressed between mating couples with large and small mismatch in thermal expansion. For comparison, thermal cycling also was conducted on plain mica as well as plain silver only. In addition, the results were compared with published data of a similar mica seal using glass instead of Ag as the interlayers. For mating materials of large mismatch in thermal expansion coefficient (CTE; Inconel/alumina), the Ag/mica seal showed lower leak rates than the plain mica. For mating materials of small mismatch in CTE (SS430/alumina), the leak rates were similar for both the Ag/mica and the plain mica seal. Scanning electron microscopy was used to characterize the microstructure of the mica after thermal cycling. Microcracks, fragmentation, and wear-particle formation were observed on the mica and were correlated to the leak behavior. Overall, the novel Ag/mica seals present good thermal cycle stability for solid-oxide fuel cells, although the leak rates were greater than the corresponding mica seals with glass interlayers.
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References
N.Q. Minh, J. Am. Ceram. Soc. 76, 563 (1993).
S.C. Singhal, in Solid Oxide Fuel Cells (SOFC VI), Proceedings of the Sixth International Symposium, edited by S.C. Singhal and M. Dokiya (The Electrochemical Society, Pennington, NJ, 1999), Vol. 99-19, p. 39.
R. Bolden, K. Foger, and T. Pham, in Solid Oxide Fuel Cells (SOFC VI), Proceedings of the Sixth International Symposium, edited by S.C. Singhal and M. Dokiya (The Electrochemical Society, Pennington, NJ, 1999), Vol. 99-19, p. 80.
D. Norrick, E. Barringer, M. Kantak, D. Sanders, and G. Watson, in 2002 Fuel Cell Seminar, Palm Springs, CA, edited by M. Williams and J. Milliken (U.S. Department of Energy, 2002), pp. 960–963.
N. Lahl, L. Singheiser, K. Hilpert, K. Singh, and D. Bahadur, in Solid Oxide Fuel Cells (SOFC VI), Proceedings of the Sixth International Symposium, edited by S.C. Singhal and M. Dokiya (The Electrochemical Society, Pennington, NJ, 1999), Vol. 99-19, p. 1057.
T. Yamamoto, H. Itoh, M. Mori, N. Mori, and T. Watanabe, Denki Kagaku oyobi Kogyo Butsuri Kagaku 64, 575 (1996).
K. Ley, M. Krumpelt, J. Meiser, and I. Bloom, J. Mater. Res. 11, 1489 (1996).
P. Larsen, C. Bagger, M. Morgensen, and J. Larsen, in Solid Oxide Fuel Cells-IV edited by M. Dokiya, O. Yamamoto, H. Tagawa, and S. Singhal (The Electrochemical Society, Pennington, NJ, 1995), PV 95-1, Vol. 69, pp. 69–78.
Z.G. Yang, K.S. Weil, D.M. Paxton, and J.W. Stevenson, in 2002 Fuel Cell Seminar, Palm Springs, CA, edited by M. Williamsand J. Milliken (U.S. Department of Energy, 2002), pp. 522–525.
J. Kim and A. Virkar, in Solid Oxide Fuel Cells (SOFC VI), Proceedings of the Sixth International Symposium, edited by S.C. Singhal and M. Dokiya (The Electrochemical Society, Pennington, NJ, 1999), Vol. 99-19, p. 830.
S.P. Simner and J.W. Stevenson, J. Power Sources 102, 310 (2001).
Y-S. Chou, J.W. Stevenson, and L.A. Chick, J. Power Sources 112, 130 (2002).
Y-S. Chou and J.W. Stevenson, J. Power Sources 112, 376 (2002).
N. Lahl, D. Bahadur, K. Singh, L. Singheiser, and K. Hilpert, J. Electrochem. Soc. 149, A607 (2002).
N. Oishi, N.P. Brandon, R. Rudkin, B.C.H. Steele, G. Lewis, and T. McColm, in 2002 Fuel Cell Seminar, Palm Springs, CA, edited by M. Williams and J. Milliken (U.S. Department of Energy, 2002), pp. 878–881.
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Chou, YS., Stevenson, J.W. Novel silver/mica multilayer compressive seals for solid-oxide fuel cells: The effect of thermal cycling and material degradation on leak behavior. Journal of Materials Research 18, 2243–2250 (2003). https://doi.org/10.1557/JMR.2003.0313
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DOI: https://doi.org/10.1557/JMR.2003.0313