Abstract
The reaction mechanism between electroless Ni–P and Sn was investigated to understand the effects of Sn on solder reaction-assisted crystallization at low temperatures as well as self-crystallization of Ni–P at high temperatures. Ni3Sn4 starts to form in a solid-state reaction well before Sn melts. Heat of reaction for Ni3Sn4 was measured during the Ni–P and Sn reaction (241.2 J/g). It was found that the solder reaction not only promotes crystallization at low temperatures by forming Ni3P in the P-rich layer but also facilitates self-crystallization of Ni–P by reducing the transformation temperature and heat of crystallization. The presence of Sn reduces the self-crystallization temperature of Ni–P by about 10 °C. The heat of crystallization also decreases with an increased Sn thickness.
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Sohn, Y.C., Yu, J., Kang, S.K. et al. Study of the reaction mechanism between electroless Ni–P and Sn and its effect on the crystallization of Ni–P. Journal of Materials Research 18, 4–7 (2003). https://doi.org/10.1557/JMR.2003.0002
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DOI: https://doi.org/10.1557/JMR.2003.0002