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Grain Morphology of Intermetallic Compounds at Solder Joints

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Abstract

The grain morphology of the intermetallic compound (IMC) that forms at the interface between liquid solders and solid-metal substrates was observed at solder joints. Cu6Sn5 grains on Cu substrates were rough or rounded, and Ni3Sn4 grains on Ni substrates were faceted. Through the energy-based calculations, the relationship between the IMC grain morphology and Jackson’s parameter α was explained. The Jackson’s parameter of the IMC grain with a rough surface is smaller than 2 while it is larger than 2 for faceted grains.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Kusung-Dong 373-1, Yusung-Gu, 305-701, Taejon, Korea

    Won Kyoung Choi, Se-Young Jang, Jong Hoon Kim, Kyung-Wook Paik & Hyuck Mo Lee

Authors
  1. Won Kyoung Choi
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  2. Se-Young Jang
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  3. Jong Hoon Kim
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  4. Kyung-Wook Paik
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  5. Hyuck Mo Lee
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Correspondence to Hyuck Mo Lee.

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Choi, W.K., Jang, SY., Kim, J.H. et al. Grain Morphology of Intermetallic Compounds at Solder Joints. Journal of Materials Research 17, 597–599 (2002). https://doi.org/10.1557/JMR.2002.0084

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  • DOI: https://doi.org/10.1557/JMR.2002.0084

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