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Effect of annealing on microstructure, residual stress, and hardness of Al–Ti multilayered films

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Abstract

Al–Ti multilayered films (12 at.% Ti) with bilayer period of 16 nm were deposited by magnetron sputtering. The films were annealed in vacuum at 350 or 400 °C between 2 and 24 h. During annealing, a diffusion-controlled chemical reaction between Al and Ti layers led to Al3Ti precipitation. Differential thermal analysis studies showed an exothermic reaction associated with Al3Ti formation, taking place between 320 and 390 °C, depending on the heating rate. The evolution of microstructure with annealing was examined with transmission electron microscopy and x-ray diffraction. The hardness and residual stress of the films in the as-deposited and annealed conditions were studied in relation to the microstructural changes on annealing.

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Authors and Affiliations

  1. Defence Metallurgical Research Laboratory, 500 058, Kanchanbagh, Hyderabad, India

    R. Mitra

  2. Advanced Coating Technology Group, Northwestern University, 60208, Evanston, Illionois, USA

    A. Madan & R. A. Hoffman

  3. Department of Materials Science and Engineering, Northwestern University, 60208, Evanston, Illionois, USA

    W.-A. Chiou & J. R. Weertman

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  1. R. Mitra
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  2. A. Madan
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  4. W.-A. Chiou
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  5. J. R. Weertman
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Mitra, R., Madan, A., Hoffman, R.A. et al. Effect of annealing on microstructure, residual stress, and hardness of Al–Ti multilayered films. Journal of Materials Research 16, 2064–2076 (2001). https://doi.org/10.1557/JMR.2001.0283

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  • DOI: https://doi.org/10.1557/JMR.2001.0283

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