Abstract
The effect of microstructure on residual stress in diamond thin film was investigated. The diamond thin film was deposited by the hot filament chemical vapor deposition process with hydrogen/methane precursor gas and followed by annealing at 1150 °C for 1–30 min. The residual stresses of the diamond thin film were measured by Raman spectroscopy. A model to estimate the residual stress was proposed on the basis of grain boundary relaxation mechanism and microstructural analysis of diamond thin film. It is confirmed that the residual stress in diamond thin film is proportional to a microstructural factor, 1/ [D( f + 1)]1/2, where D is the grain size of diamond and f is the volume ratio of nondiamond carbon/diamond.
Similar content being viewed by others
References
H. Windischmann, G.F. Epps, Y. Cong, and R.W. Collins, J. Appl. Phys. 63, 2231 (1991).
H. Guo and M. Alam, Thin Solid Film 212, 173 (1992).
P.R. Chalker, A.M. Jones, C. Johnston, and I.M. Buckley-Golder, Surf. Coat. Technol. 47, 365 (1991).
Y.H. Chiou, C.T. Hwang, M.Y. Han, J.H. Jou, Y.S. Chang, and H.C. Shih, Thin Solid Film 253, 119 (1994).
C.T. Kuo, C.R. Lin, and H.M. Lien, Thin Solid Film 290–291, 254 (1996).
J.A. Bablio, B.C. Farnsworth, S. Hankin, G. Hamill, and D. O’Neil, Thin Solid Film 212, 180 (1992).
W. Wang, K. Liao, J. Gao, and A. Liu, Thin Solid Film 215, 174 (1992).
D. Schwarzbach, R. Haubner, and B. Lux, Diamond Rel. Mater. 3, 757 (1994).
S.K. Choi and H.M. Choi, J. Vac. Sci. Technol. A 14, 165 (1996).
P.M. Fabis, Thin Solid Film 288, 193 (1996).
M.H. Grimsditch, Phys. Rev. B 32, 901 (1985).
H. Bopart, Phys. Rev. B 32, 1423 (1985).
K. Kobashi, K. Nishimura, K. Miyata, K. Kumagai, and A. Nakaue, J. Mater. Res. 5, 2469 (1990).
C.C. Chiu, Y. Liou, and Y.D. Juang, Thin Solid Film 260, 118 (1995).
S.C. Sharma, M. Green, R.C. Hyer, C.A. Dark, T.D. Black, A.R. Chourasia, D.R. Chopra, and K.K. Mishra, J. Mater. Res. 5, 2424 (1990).
R.W. Hoffman, Phys. Thin Film 3, 211 (1966).
W.D. Nix and B.M. Clemens, J. Mater. Res. 14, 3467 (1999).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Cha, S.I., Hong, S.H. Analysis and modeling of residual stress in diamond thin film deposited by the hot-filament chemical vapor deposition process. Journal of Materials Research 16, 1953–1959 (2001). https://doi.org/10.1557/JMR.2001.0267
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/JMR.2001.0267