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Sintering of screen-printed platinum thick films for electrode applications

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Abstract

Pt electrodes with a 6–8-μm thickness were produced on alumina substrates by a double-print Pt screen-printing process that included a sequential heat treatment at 600 °C and 1300 °C. This process improved the final sintered double-print film because the first printed layer acted as a sintering template for the second printed layer. The sintered Pt films have a 95% coverage of the alumina surface, 92% density, 0.73-μm average surface roughness, and 16.10−5 Ω cm resistivity. The sintering behavior of Pt films exhibited three stages of densification: Stage I (T °C < 700 °C), exhibiting neck growth, and Stage II (700 < T °C < 1300 °C), exhibiting grain growth, have activation energies of 64 kJ/mol and 125 kJ/mol, respectively. Stage III exhibits a decrease in shrinkage due to Pt coalescence and island formation. The transition temperature, 700 °C, between Stages I and II corresponds to an anomalous increase in surface roughness and resistivity. The thickness of Pt films was a critical parameter for achieving alumina surface coverage. Uniaxial pressing of dried Pt films increased densification and reduced the surface roughness of double-print Pt films.

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Author notes

  1. G. R. Fox

    Present address: Ramtron International Corporation, 1850 Ramtron Drive, 80921, Colorado Springs, CO, USA

Authors and Affiliations

  1. Laboratoire de Céramique, Ecole Polytechnique Fédérale de Lausanne, CH-1015, Lausanne, Switzerland

    J. B. Véchembre & G. R. Fox

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  1. J. B. Véchembre
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  2. G. R. Fox
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Véchembre, J.B., Fox, G.R. Sintering of screen-printed platinum thick films for electrode applications. Journal of Materials Research 16, 922–931 (2001). https://doi.org/10.1557/JMR.2001.0131

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  • DOI: https://doi.org/10.1557/JMR.2001.0131

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