Abstract
In this work we report a high-tensile ductility in a fully dense bulk nanocrystalline (nc) pure copper sample prepared by electrodeposition. A tensile ductility with an elongation to fracture of 30% was obtained in the nc Cu specimen with an average grain size of 27 nm, which is comparable to that for the coarse-grained polycrystalline Cu. An enhanced yield stress (119 MPa) and a depressed strain hardening exponent (0.22) were observed in the nc Cu sample with respect to the conventional polycrystalline Cu. The high-tensile ductility was attributed to the minimized artifacts in the nc sample, and the grain-boundary sliding deformation mechanism resulted from the numerous amount small-angle grain boundaries and the low microstrain (dislocation density).
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
R. Bohn, T. Haubopld, R. Birringer, and H. Gleiter, Scr. Metall. Mater. 25, 811 (1991).
P.G. Sanders, J.A. Eastman, and J.R. Weertman, in Processing and Properties of Nanocrystalline Materials, edited by C. Suryanarayana, J. Singh, and F.H. Froes (TMS, Warrendale, PA, 1996), p. 379.
C.C Koch, D. Morris, K. Lu, and A. Inoue, MRS Bull. 24(2), 54 (1999).
N. Wang, Z. Wang, K.T. Aust, and U. Erb, Mater. Sci. Eng. A 237, 150 (1997).
P.G. Sanders, J.A. Eastman, and J.R. Weertman, Acta Mater. 45, 4019 (1997).
C.J. Youngdahl, P.G. Sanders, J.A. Eastman, and J.R. Weertman, Scr. Mater. 37, 809 (1997).
U. Erb, A.M. El-Sherik, G. Palumbo, and K.T. Aust, Nanostruct. Mater. 2, 383 (1993).
H.P. Klug and L.E. Alexander, X-ray Diffraction Procedures for Polycrystalline and Amorphous Materials (John Wiley and Sons, New York, 1974), p. 618.
M.L. Sui, L. Lu, and K. Lu (unpublished).
R.W. Hertzberg, Deformation and Fracture Mechanism of Engineering Materials, 2nd ed. (John Wiley and Sons, New York, 1983), p. 17.
G.W. Nieman, J.R. Weertman, and R.W. Siegel, J. Mater. Res. 6, 1012 (1991).
R.W. Siegel and G.E. Fougere, in Nanophase Materials, edited by G.C. Hadjipanayis and R.W. Siegel (Kluwer, Dordrecht, The Netherlands, 1994), p. 233.
C.C. Koch, Nanostruct. Mater. 2, 109 (1993).
J. Schiotz, F.D. Di Tolla, and K.W. Jacobsoen, Nature 391, 561 (1998).
B. Cai, Q.P. Kong, L. Lu, and K. Lu, Scr. Metall. 41, 755 (1999).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Lu, L., Wang, L.B., Ding, B.Z. et al. High-tensile ductility in nanocrystalline copper. Journal of Materials Research 15, 270–273 (2000). https://doi.org/10.1557/JMR.2000.0043
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/JMR.2000.0043