Abstract
Physical-vapor-deposited thin metal films often exhibit tensile residual stresses. We studied the stress evolution in thin Cr films and found that increasing bombardment with energetic particles (atoms or ions) at low energies leads to an increase of tensile stress to a maximum followed by a rapid decrease. Microstructural characterization by transmission electron microscopy revealed that two different microstructures are observed for the same level of tensile stress: films processed at low bombardment had columnar porosity while no porosity was observed in films processed at higher bombardment. The observed stress evolution is interpreted by considering how the mean interatomic distance (and hence the force) in the intercolumnar regions is modified by energetic particle bombardment.
Similar content being viewed by others
References
J.A. Thornton and D.W. Hoffman, Thin Solid Films 171, 5 (1989).
M.F. Doerner and W.D. Nix, Crit. Rev. Solid State Mater. 14, 25 (1988).
E.S. Machlin, Materials Science in Microelectronics—The Relationships between Thin Film Processing and Structure (GIRO Press, New York, 1995), Vol. 1, pp. 157–184.
R. Abermann, Vacuum 41, 1279 (1990).
C.V. Thompson and R. Carel, J. Mech. Phys. Solids 44, 657 (1996).
A.L. Shull and F. Spaepen, J. Appl. Phys. 80, 6243 (1996).
D.W. Hoffman, Thin Solid Films 34, 185 (1976).
W.D. Nix and B.M. Clemens, J. Mater. Res. 14, 3467 (1999).
P. Chaudhari, J. Vac. Sci. Technol. 9, 520 (1972).
R.C. Cammarata, J.C. Bilello, A. Lindsay Greer, K. Sieradzki, and S.M. Yalisove, MRS Bull. 24(2), 34 (1999).
A. Misra, S. Fayeulle, H. Kung, T.E. Mitchell, and M. Nastasi, Appl. Phys. Lett. 73, 891 (1998).
A. Misra, S. Fayeulle, H. Kung, T.E. Mitchell, and M. Nastasi, Nucl. Inst. Meth. B 148, 211 (1999).
S. Kadlec, C. Quaeyhaegens, G. Knuyt, and L.M. Stals, Surf. Coat. Technol. 89, 177 (1997).
R.H. Wade and J. Silcox, Phys. Status Solidi 19, 63 (1967).
A. Banerjea and J.R. Smith, Phys. Rev. B 37, 6632 (1988).
J.H. Rose, J. Ferrante, and J.R. Smith, Phys. Rev. Lett. 47, 675 (1981).
A. Misra, H. Kung, T.E. Mitchell, and M. Nastasi (unpublished).
K.H. Muller, J. Appl. Phys. 62, 1796 (1987).
N.A. Marks, D.R. McKenzie, and B.A. Pailthorpe, Phys. Rev. B 53, 4117 (1996).
X.W. Zhou, R.A. Johnson, and H.N.G. Wadley, Acta Mater. 45, 1513 (1997).
C.M. Gilmore and J.A. Sprague, Phys. Rev. B 44, 8950 (1991).
A.F. Voter and T.C. Germann, in Mechanisms and Principles of Epitaxial Growth in Metallic Systems, edited by L.T. Willie, C.P. Burmester, K. Terakura, G. Comsa, and E.D. Williams (Mater. Res. Soc. Symp. Proc. 528, Warrendale, PA, 1998), p. 221.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Misra, A., Nastasi, M. Evolution of tensile residual stress in thin metal films during energetic particle deposition. Journal of Materials Research 14, 4466–4469 (1999). https://doi.org/10.1557/JMR.1999.0605
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/JMR.1999.0605