Abstract
A totally new technique of surface modification—thermal surface-alloying treatment for pure copper—was developed. A 0.2–1.8 mm copper alloy layer, which has a hardness 4 to 5 times higher than the pure copper substrate, was formed after the treatment. The significance of this technique is that the surface of pure copper can be efficiently hardened without significant reduction of the overall thermal and electrical conductivity. Variations of composition and microstructure in the alloy layer were studied after pure copper was surface alloy treated with aluminum.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
K.G. Budinski, Surface Engineering for Wear Resistance, (Prentice Hall, Inc., Englewood Cliffs, NJ, 1988), p. 161.
B. Dubrujeaud, A. Fontes, P. Forget, and C. Papahpilippou, Surf. Eng. (UK), 13, 461 (1997).
Y. Tsunekawa, Materia Japan, 34, 730 (1995).
A. Hirose and K.F. Kobayashi, Mater. Sci. Eng. A, A174, 199 (1994).
J.N. Kamalu and D.S. McDarmaid, Diffusion Bonding 2, (Elsevier Science Publishers Ltd., New York, 1991), p. 119.
R. Zemker, Mater. Sci. Forum 102–104, 459 (1992).
E. McCafferty, P.M. Natishan, and G.K. Hubler, Interface 2(3), 45 (1993).
I. Manna and J.D. Majumdar, J. Mater. Sci. Lett. 20, 920 (1993).
R.S. Timsit and D.C. Lauzon, J. Mater. Res. 9, 531 (1994).
A.R. Bailey, A Text-Book of Metallurgy (Macmillan and Co. Ltd., London, 1954), p. 503.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Zhang, M.X., Reilly, K. & Kelly, P.M. A new surface-alloying technique for pure copper. Journal of Materials Research 14, 3271–3274 (1999). https://doi.org/10.1557/JMR.1999.0442
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/JMR.1999.0442