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Reply to the comments of O. Jørgensen et al.

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Abstract

Large scale yielding (LSY), in general, has a profound influence on the fracture toughness of metal/dielectric interfaces. For thin metal film/dielectric systems exhibiting “weak” bonding, small-scale yielding (SSY) prevails due to local plastic dissipation intrinsic to crack growth and the high yield strength of metal thin films. For systems involving low yield strength materials and strong interfaces, a more detailed LSY methodology needs to be developed.

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Authors and Affiliations

  1. Division of Applied Sciences, Harvard University, Massachusetts, 02138, Cambridge, USA

    A. Bagchi & A. G. Evans

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  1. A. Bagchi
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  2. A. G. Evans
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Bagchi, A., Evans, A.G. Reply to the comments of O. Jørgensen et al.. Journal of Materials Research 11, 2111–2112 (1996). https://doi.org/10.1557/JMR.1996.0267

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  • DOI: https://doi.org/10.1557/JMR.1996.0267

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