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High-temperature creep of low-dielectric-constant glass composites

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Abstract

The constant-stress compressive creep behavior of a low-dielectric constant (low-k) glass composite, containing a low-softening-point borosilicate glass (BSG) and a high-softening-point high silica glass (HSG), has been investigated at 800–950 °C. For all stages of creep, the deformation behavior exhibits linear viscoelasticity, and is controlled by viscous flow of the low-softening-point borosilicate glass. An analytical expression is proposed to describe mathematically the creep behavior of the glass composite, and the results show a fairly good agreement with experimental observations.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Tsing Hua University, Taiwan, Hsinchu, Republic of China

    Jau-Ho Jean

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  1. Jau-Ho Jean
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Jean, JH. High-temperature creep of low-dielectric-constant glass composites. Journal of Materials Research 11, 2098–2103 (1996). https://doi.org/10.1557/JMR.1996.0264

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  • DOI: https://doi.org/10.1557/JMR.1996.0264

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