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Development of an economical electron backscattering diffraction system for an environmental scanning electron microscope

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Abstract

A low cost, highly versatile electron backscattering diffraction system has been developed for an ElectroScan E3 Environmental Scanning Electron Microscope (ESEM). A P20 phosphor coated screen is placed in the microscope environment to image electron backscattering diffraction patterns (EBSP’s). A CCD TV camera is used to view the patterns through a leaded glass port in the microscope specimen chamber. This system has a spatial resolution approaching 5 μm and yields analyzable patterns at pressures of up to 6 Torr. With minor modifications this system may be adapted to fit any scanning electron microscope. Comparison of analyses of the grain boundary misorientation of a Ni-16Cr-9Fe alloy with this system and by selected area channeling patterns (SACP’s), performed in a standard SEM, yielded excellent agreement between the two techniques. Owing to the capability to perform on-line analysis of EBSP’s, the EBSP technique required only half the time as the SACP technique. The capabilities of the system are illustrated in a study of the grain boundary character distribution of Ni-16Cr-9Fe following thermomechanical treatment.

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Authors and Affiliations

  1. Department of Nuclear Engineering, University of Michigan, Michigan, 48109, Ann Arbor, USA

    V. Thaveeprungsriporn

  2. North Campus Electron Microbeam Analysis Laboratory, University of Michigan, Michigan, 48109, Ann Arbor, USA

    J. F. Mansfield

  3. Department of Nuclear Engineering and Materials Science Engineering, University of Michigan, Michigan, 48109, Ann Arbor, USA

    G. S. Was

Authors
  1. V. Thaveeprungsriporn
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  2. J. F. Mansfield
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  3. G. S. Was
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Thaveeprungsriporn, V., Mansfield, J.F. & Was, G.S. Development of an economical electron backscattering diffraction system for an environmental scanning electron microscope. Journal of Materials Research 9, 1887–1895 (1994). https://doi.org/10.1557/JMR.1994.1887

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  • DOI: https://doi.org/10.1557/JMR.1994.1887

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