Abstract
A novel testing technique has been developed capable of measuring the interfacial fracture resistance, Γi, of thin ductile films on substrates. In this technique, the thin film on the substrate is stressed by depositing onto the film a second superlayer of material, having a large intrinsic stress, such as Cr. Subsequent processing defines a precrack at the interface between the film and the substrate. The strain energy available for driving the debond crack is modulated by varying the thickness of the Cr superlayer. Spontaneous decohesion occurs for superlayers exceeding a critical thickness. The latter is used to obtain Γi from elasticity solutions for residually stressed thin films. The technique has been demonstrated for Cu thin films on silica substrates.
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References
P.S. Ho, Appl. Surf. Sci. 41–42, 559 (1989).
M.D. Thouless, J. Vac. Sci. Technol. A 9, 2510 (1991).
J.W. Hutchinson and Z. Suo, Adv. Appl. Mech. 29, 63 (1992).
A. G. Evans, M. Rühle, B. J. Dalgleish, and P. G. Charalambides, Metall. Trans. 21A, 2419 (1990).
P. G. Charalambides, J. Lund, A. G. Evans, and R. M. McMeeking, J. Appl. Mech. 56, 77 (1989).
J. S. Wang and Z. Suo, Acta Metall. Mater. 38, 1279 (1990).
J. Ahn, K. L. Mittal, and R. H. MacQueen, Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings, ASTM STP 640, edited by K.L. Mittal (American Society for Testing and Materials, 1978), p. 134.
T.W. Wu, J. Mater. Res. 6, 407 (1991).
S. Venkataraman, D. L. Kohlstedt, and W. W. Gerberich, J. Mater. Res. 7, 1126 (1992).
K-S. Kim and N. Aravas, Int. J. Solids Struct. 24, 417 (1988).
K-S. Kim and J. Kim, J. Eng. Mat. Tech. 110, 266 (1988).
M.G. Allen and S.D. Senturia, J. Adhesion 25, 303 (1988).
M.G. Allen and S.D. Senturia, J. Adhesion 29, 219 (1989).
A.G. Evans and B.J. Dalgleish, Acta Metall. Mater. 40, Suppl., S295 (1992).
M. L. Jokl, V. Vitek, and C.J. McMahon, Jr., Acta Metall. Mater. 28, 1479 (1980).
V. Tvergaard and J.W. Hutchinson, J. Mech. Phys. Solids 41, 1119 (1993).
M.D. Drory, M.D. Thouless, and A.G. Evans, Acta Metall. Mater. 36, 2019 (1988).
S. Timoshenko, J. Opt. Soc. Am. 11, 223 (1925).
M. S. Hu and A. G. Evans, Acta Metall. Mater. 37, 917 (1989).
S.S. Wong, J.S. Cho, H.K. Kang, and C.H. Ting, Electronic Packaging Materials Science V, edited by E. D. Lillie, P. S. Ho, R. Jaccodine, and K. Jackson (Mater. Res. Soc. Symp. Proc. 203, Pittsburgh, PA, 1991), p. 347.
G.G. Stoney, Proc. R. Soc. London Ser. A 82, 172 (1909).
M.E. Thomas, M.P. Hartnett, and J.E. Mckay, J. Vac. Sci. Technol. A 6, 2570 (1988).
R. Abermann, Thin Films: Stresses and Mechanical Properties III, edited by W. D. Nix, J.C. Bravman, E. Arzt, and L.B. Freund (Mater. Res. Soc. Symp. Proc. 239, Pittsburgh, PA, 1992), p. 25.
J. A. Ruud, D. Josell, F. Spaepen, and A. L. Greer, J. Mater. Res. 8, 112 (1993).
M. Janda, Thin Solid Films 142, 37 (1986).
R. M. Cannon, R. M. Fisher, and A. G. Evans, Thin Films—Interfaces and Phenomena, edited by R. J. Nemanich, P. S. Ho, and S. S. Lau (Mater. Res. Soc. Symp. Proc. 54, Pittsburgh, PA, 1986), p. 799.
J. G. Li, J. Mater. Sci. Lett. 11, 903 (1992).
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Bagchi, A., Lucas, G.E., Suo, Z. et al. A new procedure for measuring the decohesion energy for thin ductile films on substrates. Journal of Materials Research 9, 1734–1741 (1994). https://doi.org/10.1557/JMR.1994.1734
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DOI: https://doi.org/10.1557/JMR.1994.1734