Abstract
This work describes the formation of stoichiometric AlN films by single ion-beam sputtering of Al, using an ionized N2 (75%) + H2 (25%) mixture, onto substrates heated to 200 °C or above. The role of substrate temperature on film composition and properties is followed in the substrate temperature range between ambient and 250 °C. Infrared spectra of freshly prepared and 2 month old (aged in air) films demonstrate that substrate heating significantly affects the chemical nature of the resulting films. SEM and STM data, combined with IR and UV-visible spectral results, indicate that films formed at a substrate temperature of ≥200 °C are very smooth and highly resistant to attack by atmospheric gases. X-ray diffraction data show no diffraction peaks, indicating that the film is either amorphous or crystalline on a scale of less than 4 nm.
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W.M. Yim, E.J. Stofko, P.J. Zanzucchi, J.I. Pankove, M. Ettenberg, and S. L. Gilbert, J. Appl. Phys. 44, 292 (1973).
L. M. Sheppard, Ceram. Bull. 69, 1801 (1990).
A. A. Ivanko, in Handbook of Hardness Data, edited by G. V. Samsonov (Keter Press, Jerusalem, 1971).
U. Mazur, work in progress.
N. Azema, R. Durand, C. Dupuy, and L. Cot, J. Euro. Ceram. Soc. 8, 291 (1991).
K. Hatwar and T. R. Pian, in Better Ceramics Through Chemistry III, edited by C. J. Brinker, D. E. Clark, and D. R. Ulrich (Mater. Res. Soc. Symp. Proc. 121, Pittsburgh, PA, 1988), p. 557.
A. D. Katnani and K. I. Papathomas, J. Vac. Sci. Technol. A 5, 1335 (1987).
A. Bellosi, E. Landi, and A. Tampieri, J. Mater. Res. 8, 565 (1993).
J. M. E. Harper, J. J. Cuomo, and H. T. Hentzell, Appl. Phys. Lett. 43, 547 (1983).
X.D. Wang, K.W. Hipps, and U. Mazur, Langmuir 8, 1347 (1992).
H. T. Hentzell, J. M. Harper, and J. J. Cuomo, in Ion Implantation and Ion Beam Processing of Materials, edited by G. K. Hubler, O.W. Holland, C.R. Clayton, and C.W. White (Mater. Res. Soc. Symp. Proc. 27, Elsevier Science Publishing, New York, 1984), p. 519.
J.M. Harper, J.J. Cuomo, and H.T. Hentzell, J. Appl. Phys. 58, 550 (1985).
H. T. Hentzell, J. M. Harper, and J. J. Cuomo, J. Appl. Phys. 58, 556 (1985).
H. Windischmann, Thin Solid Films 154, 159 (1987).
C. R. Aita and W. S. Tait, Nanostructured Materials 1, 269 (1992).
F. Hasegawa, T. Takahashi, K. Kubo, and Y. Nannichi, Jpn. J. Appl. Phys. 9, 1555 (1987).
U. Mazur, Langmuir 6, 1331 (1990).
U. Mazur and A. Cleary, J. Phys. Chem. 94, 189 (1990).
X.D. Wang, K.W. Hipps, and U. Mazur, J. Phys. Chem. 96, 8485 (1992).
J. Yang, C. Wang, X. Yan, K. Tao, B. Liu, and Y. Fan, Appl. Phys. Lett. 62, 2790 (1993).
U. Mazur, G. Fried, and K.W. Hipps, Surf. Sci. 243, 179 (1991).
G. A. Fried, X. D. Wang, and K. W. Hipps, Rev. Sci. Instrum. 64, 1495 (1993).
J.C. Manifacier, J. Gasiot, and J. P. Fillard, J. Phys. E 9, 1002 (1976).
B.D. Cullity, Elements of X-Ray Diffraction (Addison-Wesley, Reading, MA, 1978).
X.D. Wang, U. Mazur, K.W. Hipps, and J.T. Dickinson, Thin Solid Films (1994, in press).
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Wang, XD., Hipps, K.W., Dickinso, J.T. et al. Amorphous or nanocrystalline AlN thin films formed from AlN: H. Journal of Materials Research 9, 1449–1455 (1994). https://doi.org/10.1557/JMR.1994.1449
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DOI: https://doi.org/10.1557/JMR.1994.1449