Skip to main content
SpringerLink
Log in

A new method for measuring the strength and ductility of thin films

  • Articles
  • Published:
Journal of Materials Research Aims and scope Submit manuscript

Abstract

A new method of measuring the mechanical strength of thin films is described. We prepare miniature arrays of four tensile specimens, each 0.25 mm wide, 1 mm long, and 2.2 μm thick, using deposition, patterning, and etching processes common to the semiconductor industry. Each array of four specimens is carried on and protected by a rectangular silicon frame. Thirty-six such specimens are produced on a single wafer. After a specimen frame is mounted, its vertical sides are severed without damaging the specimens. The load is applied by micrometers through a special tension spring. Tensile properties of a 2.2 μm thick Ti–Al–Ti film were determined.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. J.E. Steinwall and H.H. Johnson, in Thin Films: Stresses and Mechanical Properties II, edited by M. F. Doerner, W. C. Oliver, G. M. Pharr, and F. R. Brotzen (Mater. Res. Soc. Symp. Proc. 188, Pittsburgh, PA, 1990), pp. 177–182.

    Google Scholar 

  2. R. W. Hoffman, in Thin Films: Stresses and Mechanical Properties, edited by J. C. Bravman, W. D. Nix, D. M. Barnett, and D. A. Smith (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), pp, 295 -306.

    Google Scholar 

  3. C. T. Rosenmayer, F. R. Brotzen, and R. J. Gale, in Thin Films: Stresses and Mechanical Properties, edited by J.C. Bravman, W. D. Nix, D. M. Barnett, and D.A. Smith (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), pp. 77–86.

    Google Scholar 

  4. I. Kim and R. Weil, Testing of Metallic and Inorganic Coatings, edited by W. B. Harding and G. A. DiBari (American Society for Testing Materials, STP 947, Philadelphia, PA, 1990), pp. 177–182.

    Google Scholar 

  5. T. P. Weihs, S. Hong, J. C. Bravman, and W. D Nix, in Thin Films: Stresses and Mechanical Properties, edited by J. C. Bravman, W. D. Nix, D. M. Barnett, and D. A. Smith (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), pp. 87–98.

    Google Scholar 

  6. W.D. Nix, Metall. Trans. 20A, 2217–2245 (1989).

    Article  CAS  Google Scholar 

  7. L. S. Fan, R.T. Howe, and R.S. Muller, Sensors and Actuators A21–A23, 872–874 (1990).

    Article  Google Scholar 

  8. M. Mehregany, R.T. Howe, and S.D. Senturia, J. Appl. Phys. 62, 3579–3584 (1987).

    Article  CAS  Google Scholar 

  9. D.B. Lee, J. Appl. Phys. 40, 4569–4574 (1969).

    Article  CAS  Google Scholar 

  10. M. Mehregany and S. D. Senturia, Sensors and Actuators 13, 375–390 (1988).

Download references

Author information

Authors and Affiliations

  1. Materials Reliability Division, National Institute of Standards and Technology, Colorado, 80303-3328, Boulder, USA

    David T. Read

  2. Mechanical Engineering Department, University of Maryland, Maryland, 20742, College Park, USA

    James W. Dally

Authors
  1. David T. Read
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. James W. Dally
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Read, D.T., Dally, J.W. A new method for measuring the strength and ductility of thin films. Journal of Materials Research 8, 1542–1549 (1993). https://doi.org/10.1557/JMR.1993.1542

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/JMR.1993.1542

Search

Navigation