Abstract
Subcritical crack growth behavior along polymer/glass interfaces was measured for various epoxy adhesives at different relative humidities. A four-point flexure apparatus coupled with an inverted microscope allowed for observation in situ of the subcritical crack growth at the polymer/glass interface. The specimens consisted of soda-lime glass plates bonded together with epoxy acrylate, epoxy (Devcon), or epoxy (Shell) adhesives. Above a threshold strain energy release rate, the subcritical crack velocity was dependent on the strain energy release rate via a power law relationship where the exponent was independent of the adhesive tested and the test humidity (n = 3). However, the multiplicative constant A in the power law relation varied by over three orders of magnitude between the various adhesives with epoxy (Shell) having the smallest value and the epoxy (Devcon) the greatest value; in addition, A was very sensitive to humidity, decreasing by over two orders of magnitude from 80% to 15% relative humidity. At high strain energy release rates, the subcritical crack velocity reached a plateau at approximately 10−6 m/s. The use of this subcritical crack velocity data in predicting thin film delamination is discussed.
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Conley, K.M., Ritter, J.E. & Lardner, T.J. Subcritical crack growth along epoxy/glass interfaces. Journal of Materials Research 7, 2621–2629 (1992). https://doi.org/10.1557/JMR.1992.2621
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DOI: https://doi.org/10.1557/JMR.1992.2621