Abstract
The room-temperature and 700 °C tie lines of the early transition metal–Si–Cu ternary systems have been calculated for the metals Cr, Mo, Nb, Ta, V, and W. The tie lines are determined by considering only binary and elemental phases in observance of strict stoichiometry and zero solid solubility. We find that copper is stable with the majority of transition metal silicides under consideration at 700 °C. The result is relevant to the design of stable copper metallizations for silicon.
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Reid, J.S., Kolawa, E. & Nicolet, MA. Thermodynamics of (Cr, Mo, Nb, Ta, V, or W)–Si–Cu ternary systems. Journal of Materials Research 7, 2424–2428 (1992). https://doi.org/10.1557/JMR.1992.2424
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DOI: https://doi.org/10.1557/JMR.1992.2424