Abstract
Three-dimensional chemical maps by Secondary Ion Mass Spectrometry (3D-SIMS), XPS spectroscopy, and SEM-EDAX microscopy were employed in order to investigate the effects of accelerated fatigue tests on crack formation in 95.5% Pb–2% Sn–2.5% Ag and 95% Pb–5% Sn solder joints. These alloys are used in the die bonding of electronic power device assemblies. The results show that cracks form by Sn-depletion from the inner regions of the soldered joint. Simultaneously, there is a recrystallization of the Pb-rich phase in the same regions of the joint. The crack occurs at a critical number of cycles when a Sn-depleted region is formed, yielding weaker inner layers with lower shear strength. A possible explanation of the Sn-depletion is also discussed.
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Scandurra, A., Licciardello, A., Torrisi, A. et al. Fatigue failure in Pb–Sn–Ag alloy during plastic deformation: A 3D-SIMS imaging study. Journal of Materials Research 7, 2395–2402 (1992). https://doi.org/10.1557/JMR.1992.2395
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DOI: https://doi.org/10.1557/JMR.1992.2395