Abstract
Fine-grain polycrystalline silicon has been produced by low-energy pulsed-laser irradiation of copper-implanted amorphous silicon. This fine-grained material can be regrown epitaxially on the (100) substrate using thermal annealing at temperatures ranging from 800°–1000 °C.
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Sinke, W., Saris, F.W., Barbour, J.C. et al. Solid-phase epitaxial regrowth of fine-grain polycrystalline silicon. Journal of Materials Research 1, 155–161 (1986). https://doi.org/10.1557/JMR.1986.0155
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DOI: https://doi.org/10.1557/JMR.1986.0155