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ADHESION ADHESIVES&SEALANTS

, Volume 11, Issue 1, pp 34–37 | Cite as

Durable protection for electronic components

Low-pressure molding process with shorter cycle times
  • Matthias Brachmann
Applications
  • 15 Downloads

Copyright information

© Springer Fachmedien Wiesbaden 2014

Authors and Affiliations

  • Matthias Brachmann
    • 1
  1. 1.Henkel AG & Co. KGaAWeisbadenGermany

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