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ADHESION ADHESIVES&SEALANTS

, Volume 11, Issue 1, pp 26–29 | Cite as

Rapid bonding of non-metallic materials

Bonding and sealing via induction curing
  • Arno Maurer
  • Christian Lammel
Plant and Processing Equipment

Bonding by means of electromagnetic induction enables rapid processes and a curing over the entire volume, even with bond lines that are thick or difficult to access. For induction curing, single-component and two-component systems are available for bonding and sealing of both metallic materials and non-conductive substrates.

Similar to the well-known induction hobs, by means of which meals can be rapidly and properly heated in the modern kitchen, the heating of materials via electromagnetic induction is an established industrial process, for example, in metallurgy. The energy is induced into the material by alternating electromagnetic fields in the kHz range and is converted into heat via eddy current and magnetic losses. This method can be used for rapid bonding of materials with hot-curing adhesives, especially if the adhesive joint is difficult to access by using other heat sources or when the conventional process would take too long.

In the case of electrically conductive, metal...

Notes

Thanks

We would like to thank IFF GmbH and Evonik Industries AG for their support with the measurements and for the invaluable technical discussions.

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Copyright information

© Springer Fachmedien Wiesbaden 2014

Authors and Affiliations

  1. 1.Polytec PT GmbHWaldbronnGermany
  2. 2.IFF GmbHIsmaningGermany

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