References
Habenicht, G.: Kleben - Grundlagen-Technologie-Anwendungen. Springer-Verlag, Berlin (2006)
Ehrenstein, G.W.: Handbuch Kunststoffverbindungstechnik. Carl Hanser Verlag, München (2004)
Beiss, T., Dallner, C., Schmachtenberg, E.: Vibration joining of filament reinforced thermosets. Annual technical conference - ANTEC, Conference Proceedings (2008), p. 831-835
Beiss, T., Menacher, M., Osswald, T.A.: Bonding of thermoset composites: Short process due to vibration welding technology. Adhaesion Kleben und Dichten 10 (2008), p. 22-27
Beiss, T., Menacher, M., Osswald, T.A.: Vibration Joining of Fiber-Reinforced Thermosets. Polymer Composites 31 (2010) 7, p. 1205-1212
Wacker, M.: Vibrationsschmelzkleben duroplastischer Faserverbundwerkstoffe. Dissertation, Friedrich-Alexander-Universität Erlangen-Nürnberg (2007)
Wieland, S., Properzi, M., Pichelin, F., et al.: Einsatz des linearen Vibrationsschweißens in der Holzindustrie. Newsletter Deutsche Gesellschaft für Holzforschung (2006)
Büchner, J., Henning, W.: With PU-adhesive pre-coated materials reduce process costs: Latently reactive and storable. Adhaesion Kleben und Dichten 6 (2007), p. 16-21
Acknowledgement
Following a resolution by the Deutscher Bundestag, the IGF project 16.032 N of the Forschungsvere-inigung Schweißen and verwandte Verfahren e.V. des DVS (Research Association on Welding and Allied Processes of DVS) was funded by the AiF (Allianz Industrial Research Association). The project was part of the research programme aimed at the promotion of joint research and development in industry (IGF) of the German federal ministry of economics and technology. The authors also wish to thank Bayer MaterialScience AG, Leverkusen, for generously providing the adhesive films, and Branson Ultraschall, Dietzenbach, for making the vibration welding equipment available.
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Menacher, M., Drummer, D. Cross-linking in adhesives using vibration technology. Adhes Adhes Sealants 9, 42–46 (2012). https://doi.org/10.1365/s35784-012-0047-3
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DOI: https://doi.org/10.1365/s35784-012-0047-3