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Electrodeposition of platinum metal and platinum-rhodium alloy on titanium substrates

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Abstract

A method for application of an adherent platinum (Pt) and platinum-rhodium (Pt-Rh) alloy plate to a titanium (Ti) substrate includes steps of surface pretreatment, anodization, and electrodeposition of Pt and Pt-Rh alloy from their electrolytic baths consisting of H2Pt2Cl6·6H2O (20 gL−1), and HCl (300 gL−1) for a Pt bath. The Pt-Rh bath consists of H2Pt2Cl6·6H2O (20 gL−1), and HCl (300 gL−1) and Rh2 (SO4)3 (2 gL−1). At the optimum conditions of electroplating, the Pt and Pt-Rh deposits were formed over the anodized Ti substrates with high adhesion, brightness, and high current efficiency (35.33% for Pt and 70.38% for the Pt-Rh alloy).

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Authors and Affiliations

  1. Chemistry Department, Faculty of Science, Cairo University, Egypt

    A. Baraka & H. A. Hamed

  2. Chemical Eng. & Pilot Plant, National Research Centre (NRC), Egypt

    H. H. Shaarawy

Authors
  1. A. Baraka
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  2. H. A. Hamed
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  3. H. H. Shaarawy
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Baraka, A., Hamed, H.A. & Shaarawy, H.H. Electrodeposition of platinum metal and platinum-rhodium alloy on titanium substrates. J. of Materi Eng and Perform 12, 5–13 (2003). https://doi.org/10.1361/105994903770343402

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  • DOI: https://doi.org/10.1361/105994903770343402

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