Abstract
During laser surface remelting, thermal expansion in heating, and contraction of material in cooling, and due to microstructure changes in the heated surface layer, the specimen deforms. This induces volume changes during the process of remelting the thin surface layer and causes internal stresses. By measuring the deformation of the specimen during the remelting process as well as after the laser beam interaction, i.e., to the moment when the specimen cools down to the ambient temperature, it is possible to follow the progress of deformation in the specimen material. Detailed information on the deformation events in the specimen material during the laser remelting process of a thin surface layer enables the engineer to optimize the process variables in terms of amount of deformation or magnitude of residual stresses on completion of cooling.
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References
J. Grum and R. Šturm: Appl. Surf. Sci., 1997, vol. 109–110, pp. 128–32.
J. Grum and R. Šturm: Surf. Coatings Technol., 1998, vol. 100–101, pp. 455–58.
H.W. Bergmann: Heat Treatment, ELA—Euro Laser Academy, European Post Graduate Studies, Cambridge, United Kingdom, 1994, pp. 1–27.
E. Geissler: Ph.D. Thesis, Technischen Fakultät der Universität Erlangen-Nürnberg, Nürnberg, Germany, 1993.
E. Geissler and H.W. Bergmann: Opto Elektronik Mag., 1988, vol. 4(4), pp. 396–403.
J. Mazumder and W.M. Steen: J. Appl. Phys., 1980, vol. 51(2), pp. 941–47.
J. Domes, D. Müller, and H.W. Bergmann: 3rd Eur. Conf. on Residual Stresses, DGM, Frankfurt, Germany, 1992, pp. 79–88.
W. Bloehs, B. Grünenwald, F. Dausinger, and H. Hügel: J. Laser Appl., 1996, vol. 8(1), pp. 15–23.
W. Bloehs, B. Grünenwald, F. Dausinger, and H. Hügel: J. Laser Appl., 1996, vol. 8(2), pp. 65–77.
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Grum, J., Šturm, R. Deformation of specimen during laser surface remelting. J. of Materi Eng and Perform 9, 138–146 (2000). https://doi.org/10.1361/105994900770346079
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DOI: https://doi.org/10.1361/105994900770346079