Abstract
Composite coatings of polyamide 6 (PA6) and pure quasicrystals (Al–Cu–Fe) and recycled quasicrystals (AlRec.–Cu–Fe) were developed using a solution polymer method, and the influence of these fillers on the microstructural, morphological, and electrical characteristics of the composites was analyzed. The composite coatings were produced via spin coating with a volumetric fraction of 0–11% of quasicrystalline fillers. Changes in the sample morphology were observed, inhibiting the crystalline γ form of polyamide 6 and reducing the degree of crystallinity from 35 to 10%, with a variation of \(\pm\) 1, with the addition of recycled quasicrystals (AlRec.–Cu–Fe). Furthermore, the AlRec.–Cu–Fe-based composite coatings exhibited band gap values (Eg) of approximately 1–1.3 eV, which falls within the semiconductor Eg range. The composites with AlRec.–Cu–Fe displayed electrical resistance ranging from 0.01 to 0.07 Ω, which is lower than the pure Al–Cu–Fe quasicrystal samples. Additionally, the electrical conductivity ranged from 1926.8 to 550.5 (Ω m)−1.
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Data Availability Statement
The authors declare that the data supporting the findings of this study are available within the paper, the Mater. Res. Express (https://doi.org/10.1088/2053-1591/aca37b).
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Acknowledgements
Thanks to the Materials and Biosystems Laboratory (LAMAB-UFPB) and especially to Professor Eliton Souto de Medeiros, his contribution was fundamental to the development of this work.
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Sousa, A.P., Lima, W.M.P.A., Torquato, R.A. et al. Influence of quasicrystalline fillers on the microstructural, thermal, and band gap properties of polyamide 6-based coatings with pure Al–Cu–Fe and recycled Al–Cu–Fe quasicrystals. Eur. Phys. J. Plus 138, 1126 (2023). https://doi.org/10.1140/epjp/s13360-023-04769-6
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DOI: https://doi.org/10.1140/epjp/s13360-023-04769-6