Skip to main content
SpringerLink
Log in

The effect of outlet location on heat transfer performance in micro pin-fin cooling used for a CPU

  • Regular Article
  • Published:
The European Physical Journal Plus Aims and scope Submit manuscript

Abstract

In this study, the simulation of the coolant flow using micro-pin fins in the CPU heat sink was numerically presented with ANSYS-Fluent, a Computational Fluid Dynamics (CFD) program. Four different inlet–outlet configurations were employed in the heat sink. Keeping the inlet position of the flow to the heat sink fixed, the effects of the outlet position change on the pressure drop and thermal performance were examined. The flow field and heat transfer of each case were simulated with the SST k-ω turbulence model, three-dimensional study of steady, incompressible flow. In the study, a 2 mm diameter copper tube was used in the staggered arrangement fins array with the 0.23 porosity value. Reynolds number was in the range of 5000 < Re < 12,000 and 2 kW/m2 constant heat flux to the cooling base was taken into consideration boundary conditions. Velocity streamlines, TKE and temperature distributions, Nusselt number (Nu), skin friction values (f), pressure drop (ΔP), thermal resistance (Rth) and performance criterion (PEC) changes were presented to detail the hydrodynamic and thermal performance characteristics along the heat sink surface with the increase of Reynolds number. Results showed that as the Reynolds number increased, Nusselt number increased and skin friction decreased. In addition to the improvement in heat transfer for the finned models considered according to the finless cooler, the results show that the input–output configurations make a minimum difference of 32.25% in the performance criteria. The significance and novelty of this investigation consist in a consideration of an electronic devices cooling system, as well as an assessment of the influence of inlet/outlet configuration on the cooling process for a CPU.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16
Fig. 17

Similar content being viewed by others

Abbreviations

A:

Area

cp :

Specific heat at constant pressure, (kJ/kg K)

Dh :

Hydraulic diameter, (mm)

f:

Friction factor

H:

Height of channel (mm) (see Fig. 1)

L:

Length of the channel (see Fig. 1)

h:

Heat transfer coefficient, (W/m2 K)

k:

Thermal conductivity (W/m K)

Nu:

Nusselt number

P:

Pressure, (Pa)

q”:

Heat flux (W/m2)

Re:

Reynolds number

T:

Temperature, (K, °C)

Um :

Mean velocity, (m/s)

w:

Width (mm)

Rt:

Thermal resistance

x, y, z:

Cartesian coordinates

ρ:

Density

μ:

Viscosity, (Pa s)

s:

Surface

avg:

Average

SST:

Shear stress transport

TKE:

Turbulence kinetic energy

References

  1. J.F. Tullius, T.K. Tullius, Y. Bayazitoglu, Optimization of short micro pin fins in minichannels. Int. J. Heat Mass Transf. 55(15–16), 3921–3932 (2012)

    Article  Google Scholar 

  2. Y.K. Prajapati, Influence of fin height on heat transfer and fluid flow characteristics of rectangular microchannel heat sink. Int. J. Heat Mass Transf. 137, 1041–1052 (2019)

    Article  Google Scholar 

  3. G.V. Kewalramani, G. Hedau, S.K. Saha, A. Agrawal, Study of laminar single phase frictional factor and Nusselt number in In-line micro pin-fin heat sink for electronic cooling applications. Int. J. Heat Mass Transf. 138, 796–808 (2019)

    Article  Google Scholar 

  4. T.H. Tsai, R. Chein, Performance analysis of nanofluid-cooled microchannel heat sinks. Int. J. Heat Fluid Flow 28(5), 1013–1026 (2007)

    Article  Google Scholar 

  5. C.J. Ho, L.C. Wei, Z.W. Li, An experimental investigation of forced convective cooling performance of a microchannel heat sink with Al2O3/water nanofluid. Appl. Therm. Eng. 30(2–3), 96–103 (2010)

    Article  Google Scholar 

  6. M.I. Hasan, Investigation of flow and heat transfer characteristics in micro pin fin heat sink with nanofluid. Appl. Therm. Eng. 63(2), 598–607 (2014)

    Article  Google Scholar 

  7. T. Hempijid, C. Kittichaikarn, Effect of heat sink inlet and outlet flow direction on heat transfer performance. Appl. Therm. Eng. 164, 114375 (2020)

    Article  Google Scholar 

  8. Y. Peles, A. Kos, C. Mishra, C. Kuo, B. Schneider, Forced convective heat transfer across a pin fin micro heat sink. Int. J. Heat Mass Transf. 48, 3615–3627 (2005)

    Article  Google Scholar 

  9. W. Qu, A. Siu-ho, Measurement and prediction of pressure drop in a two-phase micro-pin-fin heat sink. Int. J. Heat Mass Transf. 52(21–22), 5173–5184 (2009)

    Article  Google Scholar 

  10. T. Ambreen, A. Saleem, S.A. Shehzad, C. Woo, Performance analysis of hybrid nano fluid in a heat sink equipped with sharp and streamlined micro pin- fins. Powder Technol. 355, 552–563 (2019)

    Article  Google Scholar 

  11. H. Chiu, R. Hsieh, K. Wang, J. Jang, C. Yu, The heat transfer characteristics of liquid cooling heat sink with micro pin fi ns. Int. Commun. Heat Mass Transf. 86, 174–180 (2017)

    Article  Google Scholar 

  12. W. Yuan, J. Zhao, C.P. Tso, T. Wu, W. Liu, T. Ming, Numerical simulation of the thermal hydraulic performance of a plate pin fi n heat sink. Appl. Therm. Eng. 48, 81–88 (2012)

    Article  Google Scholar 

  13. L. Gong, J. Zhao, S. Huang, Numerical study on layout of micro-channel heat sink for thermal management of electronic devices. Appl. Therm. Eng. 88, 480–490 (2015)

    Article  Google Scholar 

  14. H.E. Ahmed, B.H. Salman, A.S. Kherbeet, M.I. Ahmed, Optimization of thermal design of heat sinks: a review. Int. J. Heat Mass Transf. 118, 129–153 (2018)

    Article  Google Scholar 

  15. D. Sahel, L. Bellahcene, A. Yousfi, A. Subasi, Numerical investigation and optimization of a heat sink having hemispherical pin fins. Int. Commun. Heat Mass Transf. 122, 105133 (2021)

    Article  Google Scholar 

  16. A.A. Hussain, B. Freegah, B.S. Khalaf, H. Towsyfyan, Numerical investigation of heat transfer enhancement in plate-fin heat sinks: effect of flow direction and fillet profile. Case Stud. Therm. Eng. 13, 2019 (2018)

    Google Scholar 

  17. X. Wang, M. Chen, D. Tate, H. Rahimi, S. Zhang, Numerical investigation on hydraulic and thermal characteristics of micro latticed pin fin in the heat sink. Int. J. Heat Mass Transf. 149, 119157 (2020)

    Article  Google Scholar 

  18. Y. Wang, K. Zhu, Z. Cui, J. Wei, Effects of the location of the inlet and outlet on heat transfer performance in pin fin CPU heat sink. Appl. Therm. Eng. 151, 506–513 (2019)

    Article  ADS  Google Scholar 

  19. S. Bhattacharyya, B. Souayeh, A. Banerjee, R. Sarkar, Numerical analysis of micro-pin-fin heat sink cooling in the mainboard chip of a CPU. Eur. Phys. J. Plus 123, 1–10 (2020)

    Google Scholar 

  20. N. Sahiti, A. Lemouedda, D. Stojkovic, F. Durst, E. Franz, Performance comparison of pin fin in-duct flow arrays with various pin cross-sections. Appl. Therm. Eng. 26(11–12), 1176–1192 (2006)

    Article  Google Scholar 

  21. H.R. Seyf, M. Feizbakhshi, Computational analysis of nanofluid effects on convective heat transfer enhancement of micro-pin-fin heat sinks. Int. J. Therm. Sci. 58, 168–179 (2012)

    Article  Google Scholar 

  22. O. Manca, S. Nardini, D. Ricci, A numerical study of nano fl uid forced convection in ribbed channels. Appl. Therm. Eng. 37, 280–292 (2012)

    Article  Google Scholar 

  23. A. Pina, P. Ferrão, J. Fournier, B. Lacarrière, O. Le Corre, Heat transfer enhancement of a molten salt parabolic trough solar receiver with concentric and eccentric pipe inserts. Energy Procedia 142, 624–629 (2017)

    Article  Google Scholar 

  24. R.L. Webb, N.Y. Kim, Enhanced Heat Transfer (Taylor and Francis, NY, 2005)

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Faculty of Technology, Department of Automotive Engineering, Sivas Cumhuriyet University, 58140 Campus, Sivas, Turkey

    Ferhat Koca

  2. Faculty of Engineering, Department of Mechanical Engineering, Yeditepe University, İstanbul, Turkey

    Mustafa Zabun

Authors
  1. Ferhat Koca
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Mustafa Zabun
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Ferhat Koca.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Koca, F., Zabun, M. The effect of outlet location on heat transfer performance in micro pin-fin cooling used for a CPU. Eur. Phys. J. Plus 136, 1115 (2021). https://doi.org/10.1140/epjp/s13360-021-02113-4

Download citation

  • Received:

  • Accepted:

  • Published:

  • DOI: https://doi.org/10.1140/epjp/s13360-021-02113-4

Search

Navigation