Abstract—
Most currently existing laser methods for separating plates into crystals are analyzed. A technique for eliminating overheating of the substrate, its melting, modification, and release of material to the surface is proposed: local laser-plasma-chemical etching using the example of polycrystalline diamond and single-crystal sapphire. The operating pressure range is 6 × 10–4–1 × 10–1 Torr.
REFERENCES
A. V. Ryzhenkov, M. R. Dasaev, O. V. Ryzhenkov, and A. V. Kurshakov, “On parameters of normalized different-scale relief created on brass surfaces by means of laser,” Int. J. Appl. Eng. Res. 12, 8824—8829 (2017).
E. D. Vaks, M. N. Milenkiy, and L. G. Saprykin, Practice of Precision Laser Processing (Tekhnosfera, Moscow, 2013) [in Russian].
E. D. Vaks, N. E. Sokolova, B. M. Sokolov, et al., Laser Processing of Holes in Ruby Technical Stones (Leningrad Dom Nauchno-Tekh. Propagandy, Leningrad, 1975) [in Russian].
A. A. Pertsev, M. V. Konyukhov, and K. A. Shcherbakov, “Method of processing materials in a liquid medium,” RF Patent No. RU 2692153, Byull. Izobret. No 18 (2019).
P. Bashta, “Laser cutting by laser microjet method,” Elektronika: Nauka, Tekhnologiya, Biznes No. 3, 1—5 (2010).
V. S. Kondratenko, “Method of cutting fragile materials,” RF Patent No. 2024441, Byull. Izobret. No. 23 (1994).
V. S. Kondratenko and S. A. Kuj, “Precision cutting of glass and other fragile materials by laser controlled thermo-scaling (review),” Steklo i Keramika No. 3, 5–12 (2017).
O. Haupt, F. Siegel, A. Schnoonderbeek, L. Richter, R. Kling, and A. Ostehdort, “Laser dicing of silicon: comparison of ablation mechanisms a novel technology of thermally induced stress,” J. Laser Micro/Nanoeng. 3 (2008).
V. S. Kondratenko, P. P. Maltsev, and S. V. Redkin, “Laser plasma-chemical processing of optoelectronic materials,” Optich. Zh. 88, 1–5 (2021).
V. S. Kondratenko, P. P. Maltsev, S. V. Redkin, “Laser plasma-chemical etching of electronic materials on the example of diamond and sapphire,” Prikl. Fiz. No. 1, 12–16 (2021).
V. V. Aristov, P. P. Maltsev, S. V. Redkin, A. S. Skripnichenko, V. Yu. Pavlov, “Method of precision laser plasma-chemical plate cutting,” RF Patent No. RU2537101 C1, Byull. Izobret. No. 36 (2014).
S. A. Gamkrelidze, P. P. Maltsev, S. V. Redkin, V. S. Kondratenko, A. S. Skripnichenko, and V. V. Styran, “Method of laser plasma-chemical cutting of plates,” RF Patent No. RU2731167 C1, Byull. Izobret. No. 25 (2020)
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Red’kin, S.V. Laser-Plasma Chemistry. Nanotechnol Russia 17 (Suppl 1), S61–S67 (2022). https://doi.org/10.1134/S2635167622070163
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DOI: https://doi.org/10.1134/S2635167622070163