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Physicochemical Features of Biocorrosion of Copper and Products Based on It by Microfungi

  • PHYSICOCHEMICAL PROBLEMS OF MATERIALS PROTECTION
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Abstract

Corrosion resistance of structural materials has become one of the most important aspects in the electronics industry. In particular, biodeterioration and biocorrosion lead to operational failures and high economic losses. Biocorrosion of copper and base materials applied for the production of printed circuit boards is studied in this work. The inevitable change in the properties and destruction of textolite and glass textolite that are used in the composition of radioelectronic components and are in contact with copper often results in violations of the performance of devices and equipment. An attempt to explain the role of biofilms of microfungi as the main factor of mycological corrosion of copper in the composition of some electronic-industry products is made in this work.

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This work was supported by regular institutional funding, and no additional grants were obtained.

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Authors and Affiliations

  1. Federal Research Center “Institute of Applied Physics”, Russian Academy of Sciences, 603950, Nizhny Novgorod, Russia

    D. V. Belov & S. N. Belyaev

  2. Institute for Physics of Microstructures, Russian Academy of Sciences, 603950, Nizhny Novgorod, Russia

    P. A. Yunin

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  1. D. V. Belov
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  2. S. N. Belyaev
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Correspondence to D. V. Belov.

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Translated by E. Boltukhina

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Belov, D.V., Belyaev, S.N. & Yunin, P.A. Physicochemical Features of Biocorrosion of Copper and Products Based on It by Microfungi. Prot Met Phys Chem Surf 59, 279–294 (2023). https://doi.org/10.1134/S2070205123700260

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