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Investigation of the Characteristics of a Graphene-Based Thermal Interface for Cooling Integrated Microcircuits

  • NANOSCALE AND NANOSTRUCTURED MATERIALS AND COATINGS
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Abstract

A study was made of a thermal interface based on a two-dimensional allotropic modification of carbon (graphene), presented in the form of a powder, for cooling integrated circuits. Such physical properties of the thermal interface as thermal conductivity, heat capacity, thermal diffusivity, and density are determined by the empirical method. The process of heat transfer in the most efficient thermal interface sample during the operation of integrated circuits in the ANSYS engineering analysis system is presented. The prospects of using pressed graphene powder as a thermal interface in order to eliminate the use of a binder are described. The paper also makes a comparison with the most effective type of thermal interfaces currently in use.

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Funding

This work was performed using the equipment of the Center for Collective Use of MIREA – Russian Technological University, which was supported by the Ministry of Science and Higher Education of the Russian Federation under agreement no. 075-15-2021-689 dated September 1, 2021, and by the Russian Science Foundation (grant no. 23-29-00079, https://rscf.ru/project/23-29-00079/).

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Authors and Affiliations

  1. MIREA – Russian Technological University, 119454, Moscow, Russia

    D. A. Prokhorov & S. M. Zuev

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  1. D. A. Prokhorov
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  2. S. M. Zuev
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Correspondence to D. A. Prokhorov or S. M. Zuev.

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The authors declare that they have no conflicts of interest.

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Translated by V. Selikhanovich

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Prokhorov, D.A., Zuev, S.M. Investigation of the Characteristics of a Graphene-Based Thermal Interface for Cooling Integrated Microcircuits. Prot Met Phys Chem Surf 59, 155–162 (2023). https://doi.org/10.1134/S2070205123700247

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  • DOI: https://doi.org/10.1134/S2070205123700247

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