Skip to main content
SpringerLink
Log in

Foreign Conductive Adhesives, Testing Methods, Properties, and Application. Review

  • Published:
Polymer Science, Series D Aims and scope Submit manuscript

Abstract

The results of the search and analysis of information in the field of modern foreign conductive adhesives (mainly silver-containing ones) are presented and their main properties, as declared by the developers, and information on their application are presented. To compare the level of characteristics of conductive adhesives, some of their values have been transferred by the authors into the same dimension, which differs from the dimension presented in the original source.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1.
Fig. 2.
Fig. 3.

Similar content being viewed by others

REFERENCES

  1. F. F. Bazarova and L. S. Kolesova, Adhesives in Manufacture of Electronic Radio Equipment (Energiya, Moscow, 1975) [in Russian].

    Google Scholar 

  2. A. P. Petrova, A. Yu. Isaev, N. F. Lukina, and B. F. Pavlyuk, “Influence of fillers on electrical conduction in adhesives and properties of current-conducting adhesives,” Klei. Germetiki. Tekhnol., No. 8, 9–15 (2018).

    Google Scholar 

  3. V. E. Gul’ and L. Z. Shenfil’, The Conducting Polymeric Compositions (Khimiya, Moscow, 1984) [in Russian].

    Google Scholar 

  4. N. S. Perov, “Design of polymeric materials on the molecular principles. II. The molecular mobility in the cross-linked complex systems,” Aviats. Mater. Tekhnol., No. 4, 51–55 (2017).

  5. K. E. Kutsevich, T. Yu. Tyumeneva, and A. P. Petrova, “Influence of fillers on properties of adhesive prepregs and PCM on their basis,” Aviats. Mater. Tekhnol., No. 4, 51–55 (2017).

  6. A. Lewis, A. B. Asymtek, Conductive adhesive dispensing process. https://smtnet.com/library/files/upload/Conductive-Adhesive-Dispensing.pdf. Cited October 5, 2020.

  7. Yu. S. Ranzhin, Yu. N. Kalashnikov, and N. P. Litvinenko, “Conductive adhesives for automated assembling of bare crystals,” Elektron. Mikroelektron. SVCh 2, 97–101 (2016).

    Google Scholar 

  8. E. N. Kablov, “Innovative developments of FSUE “VIAM” SSC of RF on realization of “Strategic Directions of the Development of Materials and Technologies of Their Processing for the Period until 2030,” Aviats. Mater. Tekhnol., No. 1, 3–33 (2015).

  9. E. N. Kablov, “Strategical areas of developing materials and their processing technologies for the period up to 2030,” Aviats. Mater. Tekhnol., No. 5, 7–17 (2012).

  10. E. N. Kablov, “Materials for aerospace engineering,” Vse Mater., No. 5, 7–27 (2007).

    Google Scholar 

  11. Brookfield ametek DV1 Digital Viscometer. Operating Instructions. Manual no. M14-023-A0416, p. 43. www.brookfieldengineering.com.

  12. V. E. Krupennikova, V. D. Radnaeva, and B. B. Tanganov, Determination of Dynamic Viscosity at a Brookfield RVDV-II+ Pro Viscometer (East Siberia State University of Technology and Management, Ulan-Ude, 2011) [in Russian].

    Google Scholar 

  13. https://ostec-materials.ru/upload/iblock/547/547018a975 8544dd9834ea204c78d0ba.pdf. Cited October 5, 2020.

  14. https://q-tech.com/wp-content/uploads/STD-883-2019. pdf. Cited October 5, 2020.

  15. Conductive Adhesives (Specification). www.henkel-adhesives.com. Cited October 5, 2020.

  16. ASTM E1461-07. Standard Test Method for Thermal Diffusivity by the Flash Method (ASTM International, West Conshohocken, PA, 2007). http:// www.astm.org/cgi-bin/resolver.cgi?E1461-07. Cited October 5, 2020.

  17. GOST (State Standard) R 57943–2017. Plastic Masses. Estimation of Heat and Thermal Conductivity. Part 4. Laser Flash Method, 2017.

  18. M. Inoue and J. Liu, “Effects of multi-modal filler size distributions on thermal conductivity of electrically conductive adhesives containing ag micro and nanoparticles,” Trans. Jpn. Inst. Electron. Packag. 2 (1), 125–133 (2009).

    Article  CAS  Google Scholar 

  19. H. Jiang, K. Moon, Y. Li, and C. P. Wong, “Ultra high conductivity of isotropic conductive adhesives,” in Proc. of the “Electronic Components and Technology Conference” (2006). https://doi.org/10.1109/ECTC.2006.1645691

    Book  Google Scholar 

  20. M. Inoue and J. Liu, “Electrical and thermal properties of electrically conductive adhesives using a heat-resistant epoxy binder,” in Proc. of the 2nd Electronics System Integration Technology Conference (2008), p. 1147–1152. https://doi.org/10.1109/ESTC.2008.4684514

Download references

Funding

This work was carried out as a part of the implementation of integrated scientific direction 15.1 “Multifunctional Adhesive Systems” (“Strategic Directions for Development of Materials and Technologies for Their Processing for the Period to 2030” [8–10]).

Author information

Authors and Affiliations

  1. All-Russian Research Institute of Aviation Materials, 105005, Moscow, Russia

    K. L. Besednov, A. P. Petrova, N. F. Lukina & A. Yu. Isaev

Authors
  1. K. L. Besednov
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. A. P. Petrova
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. N. F. Lukina
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. A. Yu. Isaev
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to K. L. Besednov.

Additional information

Translated by Sh. Galyaltdinov

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Besednov, K.L., Petrova, A.P., Lukina, N.F. et al. Foreign Conductive Adhesives, Testing Methods, Properties, and Application. Review. Polym. Sci. Ser. D 15, 40–48 (2022). https://doi.org/10.1134/S1995421222010051

Download citation

  • Received:

  • Revised:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1134/S1995421222010051

Keywords:

Search

Navigation