Abstract
A method for synthesis and purification of polydimethylboronzirconiumsiloxane, which is used as a component in a curing system for single-component organosilicon compositions applied in technologies for manufacturing of microelectronics products, is developed. It is shown that the introduction of heterosiloxane polymer allows one to obtain electroinsulating corrosion-passive coatings that possess high adhesion to structural materials and operate in a wide temperature range under conditions of increased humidity.
Similar content being viewed by others
References
M. V. Sobolevskii, O. A. Muzovskaya, and G. S. Popeleva, Properties and Applications of Organosilicon Products (Khimiya, Moscow, 1975) [in Russian].
M. M. Levitskii and B. G. Zavin, “Etudes about Scientists. Father of Silicon Chemistry. To the 100th Anniversary of Academician K. A. Andrianov,” Vestn. Ross. Akad. Nauk 74 (12), 1106–1122 (2004).
G. E. Popova, “Silicon-organic protective materials in microelectronics products and in technology of printed circuit boards,” Obz. Elektron. Tekh., Ser. 6, Mater. 8 (1414) (1988).
A. A. Labutin, Anticorrosive and Sealing Materials Based on Synthetic Rubbers (Khimiya, Leningrad, 1982) [in Russian].
R. M. Minas’yan, “One-component silicone sealantsadhesives,” Polym. Sci., Ser. D 1 (4), 286–288 (2008).
S. R. Nanush’yan, “Organosilicon rapid-curing materials,” Polym. Sci., Ser. D 10, 12–17 (2010).
OST 11090.903-83. Integrated Microcircuits and Semiconductor Devices. Organic Materials for Use in Technological Assembly Processes. Listing. Requirements for Technical Characteristics. Terms of Use.
V. A. Molotova, Industrial Use of Organosilicon Coatings (Khimiya, Moscow, 1978) [in Russian].
L. M. Khananashvili and K. A. Andrianov, Technology of Element-Organic Monomers and Polymers (Khimiya, Moscow, 1983) [in Russian].
O. V. Neelova, “High-purity organosilicon casting compounds intended for use in microelectronics,” Izv. Vuzov, Khim. Khim. Tekhnol. 50 (11), 78–81 (2007).
O. V. Neelova, USSR Inventor’s Certificate No. 1708097, “Composition for protection of p-n junctions of high-voltage semiconductor device” (1991).
O. V. Neelova and R. A. Gazzaeva, “Chemical analysis of organosilicon polymers and materials on their basis, used in micro-and nanoelectronics,” Butlerovsk. Soobshch. 42 (5), 112–118 (2015).
O. V. Neelova, “Purification of low molecular weight polydimethylsiloxane rubber,” Izv. Vuzov, Ser. Khim. Khim. Tekhnol., 2008, vol. 51, no. 3, pp. 74–76.
O. V. Neelova, R. A. Gazzaeva, and A. Kh. Plieva, “One-component siloxane composition with increased passivating properties for protection of high-voltage products of electronic engineering,” in Proc. Int. Sci.-Pract. Conf. “Science and Education in the 21st Century:” In 17 Volumes. October 31, 2014 (OOO Konsaltingovaya kompaniya Yukom, Tambov, 2014), Vol. 4, pp. 114–118 [in Russian].
O. V. Neelova, “Silicone composition for the protection of electronic products with increased adhesion properties and thermal and frost resistance of coatings,” Izv. Vuzov. Khim. Khim. Tekhnol. 57 (9), 86–92 (2014).
O. V. Neelova and R. A. Gazzaeva, “Polysiloxane composite for glueing glass with metal,” Polym. Sci., Ser. D 9 (3), 255–259 (2016).
Author information
Authors and Affiliations
Corresponding author
Additional information
Original Russian Text © O.V. Neelova, R.A. Gazzaeva, 2016, published in Klei, Germetiki, Tekhnologii, 2016, No. 9, pp. 2–8.
Rights and permissions
About this article
Cite this article
Neelova, O.V., Gazzaeva, R.A. A Curing System for Polyorganosiloxane Compositions. Polym. Sci. Ser. D 11, 50–55 (2018). https://doi.org/10.1134/S1995421218010148
Received:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1995421218010148