Skip to main content
Log in

A Curing System for Polyorganosiloxane Compositions

  • Published:
Polymer Science, Series D Aims and scope Submit manuscript

Abstract

A method for synthesis and purification of polydimethylboronzirconiumsiloxane, which is used as a component in a curing system for single-component organosilicon compositions applied in technologies for manufacturing of microelectronics products, is developed. It is shown that the introduction of heterosiloxane polymer allows one to obtain electroinsulating corrosion-passive coatings that possess high adhesion to structural materials and operate in a wide temperature range under conditions of increased humidity.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. M. V. Sobolevskii, O. A. Muzovskaya, and G. S. Popeleva, Properties and Applications of Organosilicon Products (Khimiya, Moscow, 1975) [in Russian].

    Google Scholar 

  2. M. M. Levitskii and B. G. Zavin, “Etudes about Scientists. Father of Silicon Chemistry. To the 100th Anniversary of Academician K. A. Andrianov,” Vestn. Ross. Akad. Nauk 74 (12), 1106–1122 (2004).

    CAS  Google Scholar 

  3. G. E. Popova, “Silicon-organic protective materials in microelectronics products and in technology of printed circuit boards,” Obz. Elektron. Tekh., Ser. 6, Mater. 8 (1414) (1988).

    Google Scholar 

  4. A. A. Labutin, Anticorrosive and Sealing Materials Based on Synthetic Rubbers (Khimiya, Leningrad, 1982) [in Russian].

    Google Scholar 

  5. R. M. Minas’yan, “One-component silicone sealantsadhesives,” Polym. Sci., Ser. D 1 (4), 286–288 (2008).

    Article  Google Scholar 

  6. S. R. Nanush’yan, “Organosilicon rapid-curing materials,” Polym. Sci., Ser. D 10, 12–17 (2010).

    Google Scholar 

  7. OST 11090.903-83. Integrated Microcircuits and Semiconductor Devices. Organic Materials for Use in Technological Assembly Processes. Listing. Requirements for Technical Characteristics. Terms of Use.

  8. V. A. Molotova, Industrial Use of Organosilicon Coatings (Khimiya, Moscow, 1978) [in Russian].

    Google Scholar 

  9. L. M. Khananashvili and K. A. Andrianov, Technology of Element-Organic Monomers and Polymers (Khimiya, Moscow, 1983) [in Russian].

    Google Scholar 

  10. O. V. Neelova, “High-purity organosilicon casting compounds intended for use in microelectronics,” Izv. Vuzov, Khim. Khim. Tekhnol. 50 (11), 78–81 (2007).

    CAS  Google Scholar 

  11. O. V. Neelova, USSR Inventor’s Certificate No. 1708097, “Composition for protection of p-n junctions of high-voltage semiconductor device” (1991).

    Google Scholar 

  12. O. V. Neelova and R. A. Gazzaeva, “Chemical analysis of organosilicon polymers and materials on their basis, used in micro-and nanoelectronics,” Butlerovsk. Soobshch. 42 (5), 112–118 (2015).

    Google Scholar 

  13. O. V. Neelova, “Purification of low molecular weight polydimethylsiloxane rubber,” Izv. Vuzov, Ser. Khim. Khim. Tekhnol., 2008, vol. 51, no. 3, pp. 74–76.

    CAS  Google Scholar 

  14. O. V. Neelova, R. A. Gazzaeva, and A. Kh. Plieva, “One-component siloxane composition with increased passivating properties for protection of high-voltage products of electronic engineering,” in Proc. Int. Sci.-Pract. Conf. “Science and Education in the 21st Century:” In 17 Volumes. October 31, 2014 (OOO Konsaltingovaya kompaniya Yukom, Tambov, 2014), Vol. 4, pp. 114–118 [in Russian].

    Google Scholar 

  15. O. V. Neelova, “Silicone composition for the protection of electronic products with increased adhesion properties and thermal and frost resistance of coatings,” Izv. Vuzov. Khim. Khim. Tekhnol. 57 (9), 86–92 (2014).

    CAS  Google Scholar 

  16. O. V. Neelova and R. A. Gazzaeva, “Polysiloxane composite for glueing glass with metal,” Polym. Sci., Ser. D 9 (3), 255–259 (2016).

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to O. V. Neelova.

Additional information

Original Russian Text © O.V. Neelova, R.A. Gazzaeva, 2016, published in Klei, Germetiki, Tekhnologii, 2016, No. 9, pp. 2–8.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Neelova, O.V., Gazzaeva, R.A. A Curing System for Polyorganosiloxane Compositions. Polym. Sci. Ser. D 11, 50–55 (2018). https://doi.org/10.1134/S1995421218010148

Download citation

  • Received:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1134/S1995421218010148

Keywords

Navigation