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A sealing composition with high dielectric characteristics and increased optical transparency on the basis of epoxy diane resin modified with phenyl ethoxysilane

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Abstract

This paper studies the influence of the organosilicone modifier of phenyl ethoxysilane on the properties of sealing composition. It is shown that the injection of 2–4% phenyl ethoxysilane in the epoxy binder enhances and stabilizes dielectric properties of the sealing composition in highly humid conditions and increases the optic transparency of the composition in a range of 300–800 nm.

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Authors and Affiliations

  1. Stoletovs’ State University, Vladimir, ul. Gorkogo 87, Vladimir, 600000, Russia

    V. Yu. Chukhlanov, O. G. Selivanov & N. V. Chukhlanova

Authors
  1. V. Yu. Chukhlanov
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  2. O. G. Selivanov
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  3. N. V. Chukhlanova
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Correspondence to V. Yu. Chukhlanov.

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Original Russian Text © V.Yu. Chukhlanov, O.G. Selivanov, N.V. Chukhlanova, 2016, published in Klei. Germetiki. Tekhnologii, 2016, No. 1, pp. 13–18.

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Chukhlanov, V.Y., Selivanov, O.G. & Chukhlanova, N.V. A sealing composition with high dielectric characteristics and increased optical transparency on the basis of epoxy diane resin modified with phenyl ethoxysilane. Polym. Sci. Ser. D 9, 281–285 (2016). https://doi.org/10.1134/S1995421216030060

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  • DOI: https://doi.org/10.1134/S1995421216030060

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